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UNI-ROYAL 0201WMJ0153TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMJ0153TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMJ0153TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 15kΩ
- Electronic Component
- 50
- Electronic Component
- BM0257644976
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMJ0153TEE 产品概述
一、产品概述
0201WMJ0153TEE 为 UNI-ROYAL（厚声）系列厚膜贴片电阻，封装为 0201（约 0.6 mm × 0.3 mm），阻值 15 kΩ，精度 ±5%，额定功率 50 mW，最大工作电压 25 V，温度系数（TCR）±200 ppm/℃，工作温度范围 -55℃ 至 +155℃。该产品以超小封装、高集成度为特点，适合对体积要求严格的消费电子与便携式设备。
二、主要参数
- 电阻类型：厚膜电阻（Thick film）
- 阻值：15 kΩ
- 精度：±5%（J）
- 额定功率：50 mW（在规定环境与 PCB 散热条件下）
- 工作电压：25 V（最大）
- 温度系数：±200 ppm/℃（典型厚膜级别）
- 工作温度范围：-55℃ ~ +155℃
- 封装：0201（微小表贴）
三、产品特点
- 超小体积，便于高密度贴片与多层板设计，节省 PCB 面积。
- 厚膜工艺成本效益高，适合大批量通用阻值应用。
- 宽工作温度范围与良好的长期稳定性，适配多种环境。
- 与标准 SMT 流程兼容，易于自动化生产装配。
四、典型应用
- 移动终端、可穿戴设备、蓝牙/IoT 芯片周边阻值需求。
- 分压、上拉/下拉、偏置与滤波电路中的通用阻性元件。
- 功耗受限的低功耗电路与便携设备（注意功率裕量设计）。
- 大规模消费电子产品与高密度 PCB 设计中替代较大封装元件。
五、可靠性与工艺注意
- 在 0201 小封装上，实际可耗散功率受 PCB 板面与邻近元件影响显著，设计时应留有功率裕量并进行热仿真/测试。
- 典型回流焊兼容，请遵循无铅回流曲线规范（峰值温度通常 ≤ 260℃），避免超温或长时间高温暴露。
- 为保障可靠性，推荐合理的焊盘尺寸与焊膏量，避免过量焊膏或焊接应力导致的开裂。
- 存储时应避免潮湿、高温和强腐蚀性气体，卷带包装须在规定条件下使用。
六、选型与使用建议
- 若电路对阻值精度或温漂要求较高（如精密放大器输入回路），建议选用更高精度（1% 或 0.1%）及更低 TCR 的薄膜或金属薄膜电阻。
- 在高振动或机械应力环境，注意 0201 封装的抗机械强度限制，必要时选择更大封装或加强固定方式。
- 下料、贴装时使用适配的 0201 吸嘴与贴片程序，避免偏位或翻转。
七、包装与订购
- 型号：0201WMJ0153TEE，品牌：UNI-ROYAL（厚声）。
- 常见为卷带（Tape & Reel）包装，便于 SMT 贴装。具体卷带尺寸、每盘数量及可追溯批次信息请以厂方出货单或技术资料为准。
欲获取详细电气特性曲线、焊接规范（reflow profile）、可靠性测试报告或样片支持，请联系供应商索取完整数据手册。
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