WMSIC Electronic Components

UNI-ROYAL 1210W2J0101T5E

Model1210W2J0101T5E
Package1210
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 1210W2J0101T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
500mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
1210W2J0101T5E
Electronic Component
1
Package
1210
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.034g
Electronic Component
100Ω
Electronic Component
1
Electronic Component
BM0257586069
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1210W2J0101T5E 产品概述

一、产品简介

1210W2J0101T5E 是 UNI-ROYAL(厚声)出品的厚膜贴片电阻,封装为 1210(3.2 × 2.5 mm),标称阻值 100 Ω,精度 ±5%(J),额定功率 500 mW,最大工作电压 200 V,温度系数 ±100 ppm/℃,工作温度范围 -55℃ 至 +155℃。该系列以稳定性和成本效益见长,适用于通用电子、工业控制及消费类产品的电阻网络布置与限流场合。

二、主要规格(要点)

  • 型号:1210W2J0101T5E
  • 品牌:UNI-ROYAL(厚声)
  • 封装:1210(3.2 × 2.5 mm)贴片
  • 阻值:100 Ω
  • 精度:±5%(J)
  • 额定功率:500 mW
  • 最高工作电压:200 V
  • 温度系数(TCR):±100 ppm/℃(约 ±0.01%/℃,100℃ 温差约 ±1%)
  • 工作温度:-55℃ ~ +155℃
  • 类型:厚膜电阻

三、结构与封装说明

该器件采用厚膜工艺,芯体与电极经过釉层封装以提高机械强度与焊接可靠性。1210 封装在自动贴片、回流焊流程中兼容性好,适合批量 SMT 生产。通常按卷带(Tape & Reel)方式供货,方便贴片机取放。

四、性能特点与优势

  • 成本效益高:厚膜工艺在中低阻值与大批量应用上具有价格优势。
  • 温度稳定性适中:±100 ppm/℃ 满足多数通用工况的温漂要求。
  • 宽温区工作能力:-55℃ 至 +155℃ 适应工业级环境。
  • 机械与焊接可靠:适用于标准回流焊工艺,焊接强度和抗振性能良好。
  • 电压承受能力:200 V 最大工作电压,适合较高电压限流与测量场合(须结合功率与降额考虑)。

五、应用场景与使用建议

适用于电源限流、分压网络、滤波与信号整形、工业控制板、家电与通讯设备中的通用电阻需求。使用建议:在无额外散热的 PCB 条件下,应根据实际环境及热阻进行功率降额;回流焊请遵循 JEDEC/J-STD-020 推荐曲线,避免超温停留。设计时注意考虑 TCR 对精密应用的影响,如需更高精度或更低温漂,应选用金属膜或薄膜低 TCR 产品。

六、可靠性与存储

产品通过常规的温升、湿热、振动与焊接兼容性试验。建议按干燥无尘环境存储,避免长时间潮湿暴露,贴片卷带宜在密封包装内并在拆封后尽快使用;如需长期存放或回流多次,参考厂商关于湿敏等级(MSL)及烘干要求的说明。

如需样品、详细规格书(含热阻、典型温升曲线与包装规格)或替代型号推荐,请提供订购数量与应用环境,以便进一步匹配最优方案。

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