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UNI-ROYAL 1206W4J0150T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 1206W4J0150T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 1206W4J0150T5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.03g
- Electronic Component
- 15Ω
- Electronic Component
- 1
- Electronic Component
- BM0257342046
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W4J0150T5E 产品概述
一、产品概述
1206W4J0150T5E 为 UNI-ROYAL（厚声）系列贴片厚膜电阻，封装为 1206（约 3.2 × 1.6 mm），标称阻值 15 Ω，精度 ±5%（J 级），额定功率 250 mW，最大工作电压 200 V。产品采用厚膜烧结工艺制造，适用于一般电子设备中的通用分压、限流、偏置及滤波网络等场合，具有结构稳定、成本低、批量一致性好等特点。
二、主要电气参数
- 阻值：15 Ω
- 精度：±5%
- 额定功率：250 mW
- 最大工作电压：200 V
- 温度系数（TCR）：±100 ppm/℃（典型）
- 工作温度范围：-55 ℃ 至 +155 ℃
这些参数表明该型号为通用低阻值厚膜元件，适合对精度和温漂要求不是非常苛刻的应用。
三、结构与封装
该器件为 1206 封装的表面贴装电阻，典型外形尺寸约 3.2 × 1.6 mm，厚膜电阻层覆于陶瓷基片上，端部为金属化电极并覆以抗焊剂层，便于自动贴装与回流焊接。封装尺寸适配主流贴片工艺与 PCB 布局规则。
四、性能特点
- 通用性强：厚膜工艺成本低、批量稳定，适合民用及工业类常规电路使用。
- 热稳定性适中：TCR ±100 ppm/℃，在中等温度变化下阻值偏移受控，不适合高精度测量用途。
- 宽温工作范围：-55 ℃至 +155 ℃，可在较严苛环境中长期工作。
- 工艺兼容：支持常规表贴回流焊流程，便于 SMT 生产线集成。
五、典型应用场景
- 电源与电路偏置网络：限流、分压、阻尼等。
- 模拟电路的通用阻值需求场景：滤波、耦合回路。
- 消费电子、家电、仪表和部分工业控制产品中的标准阻值元件。 注：不建议用于要求高精度、低噪声或高冲击电流的精密测量场合。
六、安装与工艺建议
- 采用自动贴片设备与符合规范的回流焊曲线进行焊接，建议遵循无铅回流工艺的温度限制与时间窗，以保证端电极可靠性。
- 设计 PCB 时留意散热与铜箔面积，过大的铜面会带走热量改变额定功率表现；若长时间接近额定功率工作，建议适当做功率降额（derating）。
- 储存与处理避免潮湿、高温和机械冲击，焊接前如有潮湿敏感等级要求应按厂家建议进行干燥处理。
七、可靠性与测试
产品通过常规的电气性能与可靠性测试（如温度循环、焊接热稳定、低温冲击等），在规定的工作温度与额定功率下能维持长期稳定工作。对于关键应用，建议在项目初期进行样品评估，包括温漂、长期老化和热功率回退测试。
八、选购建议
若应用对阻值精度或温漂有更高要求，可考虑更高精度或薄膜/金属膜类电阻替代；如需更大功率或更小封装，可选择不同封装与功率等级的型号。在量产前请向供应商确认包装形式、出货测试条件及可追溯的质量报告，以确保与生产工艺匹配。
如需具体样品规格书（datasheet）、回流焊推荐曲线或可靠性测试数据，请提供采购数量与用途，我可协助准备进一步资料。
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