WMSIC Electronic Components

UNI-ROYAL 0402WGF4993TCE

Model0402WGF4993TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF4993TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF4993TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
499kΩ
Electronic Component
10
Electronic Component
BM0257244946
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF4993TCE 产品概述

一、产品简介

0402WGF4993TCE 为 UNI-ROYAL(厚声)出品的贴片厚膜电阻,封装为 0402(1.0 × 0.5 mm),标称阻值 499 kΩ,精度 ±1%,额定功率 62.5 mW,最大工作电压 50 V。工作温度范围宽 (-55 ℃ ~ +155 ℃),温度系数 (TCR) 为 ±100 ppm/℃,适用于高密度贴片电路与中高阻值精密网络等场合。

二、主要技术参数

  • 阻值:499 kΩ(标称)
  • 精度:±1%
  • 功率:62.5 mW(室温额定)
  • 最高工作电压:50 V
  • 温度系数:±100 ppm/℃
  • 工作温度:-55 ℃ ~ +155 ℃
  • 封装:0402(1005 公制)
  • 工艺:厚膜(Thick Film)

三、产品特点

  • 精度高:±1% 可满足多数精密测量与分压场合需求。
  • 小型化:0402 封装利于高密度布板与微型化终端产品。
  • 宽温度适应性:-55 ℃ ~ +155 ℃,适合工业级应用。
  • 良好性价比:厚膜工艺成本低、批量一致性好。
  • 注意事项:厚膜电阻在噪声、长期漂移与绝缘性能方面相对薄膜电阻有差异,设计时需权衡。

四、典型应用

  • 高密度 PCB 的精密分压/偏置电路
  • 传感器信号调理与滤波网络
  • 手持与便携式电子设备中的拉电阻/上拉电阻
  • 仪器仪表中非超高精度的参考/测量电路

五、安装与使用建议

  • 遵循制造商推荐的回流焊工艺(避免过高温度与长时间保温);如无数据,请采用常规贴片回流曲线并优先联系厂商确认。
  • 布局时保证足够散热路径并避免功率集中在单元件上;在高环境温度下按厂商导出的降额曲线进行功率降额。
  • 避免长期超过 50 V 或额定功率使用,以免加速老化或发生破坏。
  • 存储与搬运避免潮湿、强震与污染,建议采用原厂卷带包装并在合理期限内贴装。

六、采购与型号说明

型号“0402WGF4993TCE”可理解为:0402 封装 + WGF 系列厚膜产品,4993 表示 499 kΩ,后缀可能指精度/工艺与环保(具体含义请以厂商标注为准)。采购时建议向 UNI-ROYAL 索取完整数据手册与可靠性报告,确认 RoHS/无铅信息、包装形式(卷带/盘装)及样品测试要求。

若需更详细的电气特性曲线、温度漂移、热阻与回流焊推荐曲线,建议联系 UNI-ROYAL 厂家或代理商获取原厂 Datasheet。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.