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UNI-ROYAL 0402WGF1201TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF1201TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF1201TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 1.2kΩ
- Electronic Component
- 10
- Electronic Component
- BM0257341477
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF1201TCE 产品概述
一、产品简介
0402WGF1201TCE 为 UNI-ROYAL（厚声）出品的厚膜贴片电阻，阻值为 1.2kΩ，精度 ±1%，额定功率 62.5mW（0402 封装标准值）。器件工作电压 50V，温度系数（TCR）±100ppm/℃，工作温度范围 -55℃~+155℃。小型化封装与稳定的电气特性使其适合高密度 SMT 板级布线与各类精密偏置、分压、滤波电路。
二、主要性能参数
- 阻值：1.2kΩ
- 精度：±1%
- 封装：0402（毫米制 0.4×0.2 英寸级别）
- 额定功率：62.5mW（典型 0402 额定）
- 工作电压：50V
- 温度系数：±100ppm/℃
- 工作温度范围：-55℃～+155℃
- 制程：厚膜电阻
三、产品特性
- 小尺寸、高密度：0402 封装适配高密度 SMT 布局，节省 PCB 面积。
- 稳定性：厚膜工艺在常温及多变环境下表现出良好的一致性与长期稳定性。
- 容差与温漂：±1% 精度配合 ±100ppm/℃ 的温漂，适用于对阻值有一定精确要求的模拟与数字电路。
- 焊接兼容性：适用于常规无铅回流焊工艺，良好的可焊性满足自动化贴装与大批量生产需求。
四、典型应用
- 偏置与分压网络：适合基准、比较器及放大器的分压网络与偏置电阻。
- 数字电路：上拉/下拉电阻、滤波/时序电路中的阻值元件。
- 消费电子与移动设备：用于体积受限的移动终端、可穿戴设备、IoT 节点等。
- 测量与仪表：在不要求大功率耗散的传感器前端及信号调理电路中使用。
五、使用建议与注意事项
- 功率降额：额定功率通常以 Ta=70℃ 为基准，超过该温度应按厂商降额曲线线性降额，避免在高温环境下长期满载工作。
- 电压与过载：工作电压上限为 50V，应避免瞬态冲击超过该值以防击穿或电阻漂移。
- 焊接工艺：兼容无铅回流，但应遵循 PCB 热阻与回流曲线，避免过高峰值温度与长时间高温暴露。
- 储存与搬运：防潮、防尘，避免强酸碱环境及机械损伤，卷带供货应按 ESD 控制要求操作。
六、包装与可靠性
- 供货形式：常规卷带（Tape & Reel）适配自动贴片机。
- 可靠性试验：通过温度循环、焊接可靠性、机械冲击与负载寿命等行业常规可靠性验证，满足 PCB 级长期使用需求。
- 选型提示：如需更低温漂或更高功率，请参考 UNI-ROYAL 的其它系列或联系供应商获取完整规格书与回流曲线、降额数据。
如需样品、详细规格书或可靠性报告（如温度系数曲线、功率降额曲线、回流焊建议曲线），建议向 UNI-ROYAL（厚声）或授权代理索取，以便在设计验证阶段进行精确匹配与验证。
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