WMSIC Electronic Components

UNI-ROYAL 0402WGF1202TCE

Model0402WGF1202TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF1202TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF1202TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
12kΩ
Electronic Component
10
Electronic Component
BM0257242462
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF1202TCE 产品概述

一、主要参数

  • 类型:厚膜贴片电阻(Chip Resistor,厚声 UNI-ROYAL 品牌)
  • 阻值:12 kΩ ±1%
  • 功率:62.5 mW(1/16W)
  • 最大工作电压:50 V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:0402(公制 1005)
  • 描述:贴片电阻 62.5mW 12kΩ ±1% 厚膜电阻

二、产品特性

0402WGF1202TCE 属于厚膜工艺的超小型贴片电阻,适合高密度 SMT 组装。其主要特性包括:尺寸小、占位面积低,1% 精度可满足多数精密分压、取样与偏置电路要求;±100 ppm/℃ 的温度系数在一般消费及工业电子中具有良好稳定性;62.5 mW 的额定功率适用于低功耗信号链路与旁路电阻等场合。厚膜工艺在成本与可靠性之间有较好平衡,适合大量生产应用。

三、典型应用场景

  • 手机、可穿戴设备等消费类便携电子产品的信号电阻、分压网络;
  • 通信设备与网络终端中的偏置与耦合电阻;
  • 工业控制与传感器接口(低功耗测量回路);
  • PCB 上的参考与负载电阻(在电压和功率限制内);
    注:由于功率与最大工作电压受限,不建议用于高功率或高压电源路径。

四、使用与焊接建议

  • 焊接:兼容常规无铅回流焊工艺,建议峰值温度控制在 ≤260 ℃,并遵循合理的预热与冷却曲线以减少热应力;
  • 贴装:推荐使用对称焊盘设计,保证焊料润湿成形,避免单侧受热导致的应力集中;
  • 功率裕量:实际应用中建议留有裕量,按工作环境和长期可靠性考虑,通常按额定功率的 50%~80% 设计以提高寿命;
  • 热管理:尽量远离高热源或功率器件,避免长期高温环境运行;
  • 测试与校准:在精度敏感电路中,建议在最终环境温度下进行校准以补偿 TCR 带来的阻值漂移。

五、可靠性与储存

0402WGF 系列通过常规的可靠性试验(如焊接热冲击、湿热、振动及载流寿命测试)以符合工业级应用需求。存放时避免高温高湿环境,卷带包装应保持原封存储,开卷后建议尽快使用或在防湿袋中保存以防潮。

六、采购与包装信息

产品以标准卷带(Tape & Reel)为主,适配 SMT 自动贴片生产线。关于最小订购量、卷带尺寸(7" / 13")、可选包装形式及详细型号含义(如型号编码规则)建议咨询供应商或查看 UNI-ROYAL 的产品手册,以获取最新的物料清单和可追溯性信息。

如需更详细的电气特性曲线、焊接回流曲线或可靠性测试报告,可提供更具体的工程资料以便评估在您设计中的适配性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.