WMSIC Electronic Components

UNI-ROYAL 1206W4F1002T5E

Model1206W4F1002T5E
Package1206
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 1206W4F1002T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
1206W4F1002T5E
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.03g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM69419590
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:1206W4F1002T5E 贴片电阻

一、产品基本信息

  • 产品类别:贴片电阻
  • 功率等级:250mW
  • 阻值:10kΩ
  • 容差:±1%
  • 技术类型:厚膜电阻
  • 封装类型:1206
  • 品牌:UNI-ROYAL(厚声)

二、产品详细描述

1206W4F1002T5E是一款高性能的贴片电阻,采用厚膜技术制成,适合在众多电子设备中作为电流和电压的分配元件。其封装大小为1206(宽度0.12英寸×长度0.06英寸),这使其能够在空间限制较小的应用中使用。

三、技术参数与特性

  1. 功率处理能力:

    • 该电阻的额定功率为250mW,适合在低功耗应用中使用,可承受较长时间的持续工作而不发生性能衰减。
  2. 阻值与容差:

    • 阻值为10kΩ,结合±1%的高精度容差,适合需要高稳定性和可靠性的电路设计。此外,容差指标使其在各种应用环境中保持优异的性能,确保信号的准确传输。
  3. 厚膜技术:

    • 使用厚膜技术的电阻通常具有良好的热稳定性和高的绝缘抵抗力,这使得1206W4F1002T5E在高温和较大电流的环境下依然能够保持卓越的性能。
  4. 耐压性能:

    • 该电阻的设计考虑了耐压指标,使其在电路中能够有效防止电力过载,并允许更高的电压进行操作,确保安全性。

四、应用领域

由于其出色的性能和小巧的封装,1206W4F1002T5E被广泛应用于以下领域:

  • 消费电子产品:如手机、平板电脑、智能家居设备等,贴片电阻可以用于电源管理、信号调节等多个子系统。
  • 工业控制设备:能够在恶劣环境中维持稳定性能,适合用于传感器、监控设备及自动化设备。
  • 通信设备:广泛应用于路由器、交换机等设备中,保证数据传输的准确性和稳定性。
  • 医疗设备:在对精度要求极高的设备中,可以用作信号连接和模拟电路的关键组件。

五、使用建议与注意事项

在设计时使用1206W4F1002T5E贴片电阻时,建议:

  • 热管理:确保电阻的工作环境不超过250mW的额定功率,避免因过热导致参数变化。
  • 并联或串联使用:根据具体需求可以将电阻进行并联或串联,确定所需的总阻值,优化电路设计。
  • 焊接技术:由于其贴片设计,建议使用适合的焊接技术,如回流焊、波峰焊等,确保焊接质量,避免影响电阻性能。

六、总结

1206W4F1002T5E贴片电阻以其优越的性能、合理的设计及广泛的适用性,在现代电子设计中扮演着不可或缺的角色。无论是在消费电子、工业控件或通信设备中,它都为电路的稳定性和可靠性提供了强有力的支持。选择UNI-ROYAL的这一款贴片电阻,您将拥有高精度、高性能的电气解决方案,助力您的电子产品取得成功。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.