WMSIC Electronic Components

UNI-ROYAL 1206W4J0204T5E

Model1206W4J0204T5E
Package1206
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 1206W4J0204T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
1206W4J0204T5E
Electronic Component
1
Package
1206
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.03g
Electronic Component
200kΩ
Electronic Component
1
Electronic Component
BM0257342205
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1206W4J0204T5E 产品概述

一、产品简介

1206W4J0204T5E 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,封装规格为 1206(公制 3216),阻值 200kΩ,阻值精度 ±5%(J),额定功率 250mW,最大工作电压 200V,温度系数(TCR)±100ppm/℃,工作温度范围 -55℃ ~ +155℃。该型号属于通用型厚膜电阻,适用于各种 SMT 组装与一般电子电路中作为分压、上拉/下拉、偏置等用途。

二、主要技术参数

  • 型号:1206W4J0204T5E
  • 品牌:UNI-ROYAL(厚声)
  • 封装:1206(约 3.2mm × 1.6mm)
  • 阻值:200kΩ
  • 精度:±5%(J)
  • 额定功率:250mW
  • 最大工作电压:200V
  • 温度系数:±100ppm/℃
  • 工作温度:-55℃ ~ +155℃
  • 典型应用:通用电子、信号电路、分压器、阻抗匹配等

三、产品特点与优势

  • 通用型厚膜结构,成本与可焊性兼顾,适合批量生产与 SMT 工艺。
  • 1206 封装在同类中具备良好功率容量与尺寸平衡,便于安装与热管理。
  • 较高的耐压(200V)使其在高阻值分压电路中有更广的使用空间。
  • TCR ±100ppm/℃ 对于非高精度但需温度稳定性的应用是合理选择。
  • UNI-ROYAL 品牌供应链成熟,适配卷带贴片生产线。

四、应用场景

  • 模拟电路的分压、偏置网络与上/下拉电阻。
  • 消费类电子、工业控制与通讯设备中需要大阻值且有一定耐压的场合。
  • 一般信号处理与滤波电路中作为阻抗设定元件。
    (不建议用于高精度测量、低阻值电流检测或高能量冲击场合)

五、功率与耐压说明及降额建议

  • 额定功率 250mW 为室温下标称值;在高温环境下应按厂商降额曲线处理以保证可靠性(详细曲线请参见厂方 datasheet)。
  • 按 Ohm 定律,在 200kΩ 下,若施加 200V,电流约为 1.0mA,耗散功率约为 0.20W(200mW),接近额定值但仍在安全范围内。设计时建议保留余量,避免长时间在临界功率下运行。

六、封装、焊接与存储

  • 兼容常见回流焊工艺;建议峰值回流温度与时间参照具体工艺规范(通常峰值 ≤260℃)。
  • 卷带(Tape & Reel)包装,便于 SMT 自动贴装。
  • 存储环境应干燥、防潮、防尘,长期存放前建议按抗焊接性要求进行干燥处理。

七、可靠性与测试

  • 常规可靠性项目包括高低温循环、湿热、温度快速变化及机械振动/冲击等;UNI-ROYAL 系列产品通常通过相关环境与焊接适应性测试。
  • 对关键应用建议进行样机验证,包括电阻漂移、焊点可靠性及长期热稳定性测试。

八、选型提示与注意事项

  • 若电路需要更高精度或更低 TCR,请选用金属膜或低 TCR 厚膜品种。
  • 在高电压或接近额定功率的设计里,宜增加安全裕度或采用更大功率封装。
  • 具体尺寸公差、引脚焊盘设计、回流曲线及包装规格请以厂家最新 datasheet 为准,必要时向供应商索取样品并做实测验证。

如需该型号的完整 datasheet、回流焊工艺曲线或样品支持,我可协助提供获取建议或联系供应渠道。

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