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UNI-ROYAL 0402WGF9761TCE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0402WGF9761TCE
- Type
- UNI-ROYAL
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 62.5mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0402WGF9761TCE
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.009g
- Electronic Component
- 9.76kΩ
- Electronic Component
- 10
- Electronic Component
- BM0264879310
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 50V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402WGF9761TCE 产品概述
一、产品简介
0402WGF9761TCE 为 UNI-ROYAL（厚声）出品的厚膜贴片电阻，属 0402 小尺寸系列。标称阻值 9.76kΩ，精度 ±1%，额定功率 62.5mW，工作电压 50V，适用于对体积、精度和稳定性有中等要求的高密度贴片电路。
二、主要技术参数
- 电阻类型：厚膜电阻
- 阻值：9.76 kΩ（标称）
- 精度：±1% （F）
- 额定功率：62.5 mW
- 最高工作电压：50 V
- 温度系数（TCR）：±100 ppm/℃
- 工作温度范围：-55℃ 至 +155℃
- 封装：0402（典型尺寸约 1.0 mm × 0.5 mm）
- 品牌：UNI-ROYAL（厚声）
三、性能与优势
- 体积小、轻薄：0402 封装适合高密度贴装和微型化产品设计。
- 精度良好：±1%精度配合 ±100 ppm/℃ 的温漂，适合对阻值稳定性有一定要求的分压、滤波和偏置网络。
- 宽温度范围：-55℃~+155℃，满足工业级温度环境。
- 成本与通用性：厚膜工艺成本效益高，适合大批量生产与通用型电子产品。
四、封装与焊接建议
- 0402 为超小型贴装件，建议采用标准回流焊工艺进行装配。
- 遵循无铅回流温度规范并参考厂商数据手册的回流曲线；在回流过程中控制峰值温度和时间，以避免电阻性能退化。
- 焊盘设计应考虑热扩散与可靠的焊接强度，避免在电阻端子附近施加机械应力。
- 裸手操作或长时间暴露在潮湿环境中可能影响焊接性，建议按湿敏等级存储并在规定时间内回流。
五、应用场景
适用于移动终端、消费电子、工业控制、通信设备、传感器前端和一般分压、偏置、滤波电路等需要小尺寸与中等功耗的场合。由于额定功率较低，不建议在高功耗或热量集中区域长期满载使用。
六、可靠性与选型注意
- 在高温或高功率工作状态应考虑功率降额设计，参考具体应用的温度-功率特性曲线。
- 对于要求更高精度或低温漂的场合，可考虑薄膜或金属膜电阻替代。
- 小封装检测、打样与焊接过程控制要求较高，量产前建议进行可靠性和热循环验证。
七、总结
0402WGF9761TCE 是一款适用于高密度贴装的厚膜贴片电阻，具备 9.76kΩ/±1% 精度、62.5mW 额定功率和宽温度范围，适合多数消费与工业类低至中等功耗电路。选型时应关注散热、回流工艺与长期功率降额，按厂商资料和生产工艺规范进行最终验证。
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