Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 1206W4F750JT5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 1206W4F750JT5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 1206W4F750JT5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 75Ω
- Electronic Component
- 1
- Electronic Component
- BM0257341789
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W4F750JT5E 产品概述
一、产品简介
1206W4F750JT5E 是 UNI-ROYAL（厚声）出品的一款贴片厚膜电阻，封装为 1206（3.2 mm × 1.6 mm），标称阻值 75 Ω，公差 ±1%，额定功率 250 mW，额定工作电压 200 V。该器件适配主流 SMT 工艺，常用于对空间、精度和稳定性有要求的电子系统。
二、主要参数
- 阻值：75 Ω
- 精度：±1%
- 功率：250 mW（额定）
- 最大工作电压：200 V
- 温度系数（TCR）：±100 ppm/℃（温度变化 1℃ 时电阻约变化 0.0075 Ω）
- 工作温度范围：-55 ℃ ～ +155 ℃
- 封装：1206（厚膜贴片电阻）
- 品牌：UNI-ROYAL（厚声）
三、产品特性
- 稳定性：厚膜工艺在常温下提供良好的长期稳定性和重复性，适用于一般工业与民用电子产品。
- 容差与精度：±1% 精度适合多数精密分压、偏置及阻抗配合场合。
- 宽温适应：-55～+155 ℃ 的工作范围适合环境温度变化较大的应用场景。
- 小体积、高可靠：1206 封装在保持较好功率承受能力的同时，便于高密度 PCB 布局与自动贴片生产。
四、典型应用场景
- 视频和射频领域：75 Ω 为视频同轴与部分射频系统的常见标称阻抗，可用于终端匹配、阻抗校正与滤波网络。
- 信号处理与分压：用于精密分压器、偏置网络和放大器输入/反馈回路。
- 工业与仪表：适用于测量、控制电路中对温漂与长期稳定性有一定要求的位置。
- 一般电子设备：消费类、通信及嵌入式产品中的阻值元件。
五、选型与使用建议
- 功率余量：标称 250 mW 为额定功率，实际使用时应考虑环境温度与散热条件，必要时留有功率余量或选择更大功率型号。
- 温度漂移：TCR ±100 ppm/℃ 表明在温度波动大的场合可能会产生可测量的阻值变化，若需更高稳定性请选用更低 TCR 的产品或采用温度补偿措施。
- 焊接工艺：适配常规 SMT 工艺（回流焊），推荐按装配厂或厂商提供的焊接曲线与工艺规范操作。
六、封装与可靠性
- 尺寸为 1206，兼容自动贴片机与标准 PCB 焊盘设计。
- 常见供货形式为带卷盘（Tape & Reel），便于生产线直接使用。
- 在推荐工作范围内具有良好的抗热循环与机械可靠性；若需特殊认证（如 AEC-Q200、UL 等），请向供应商确认相关认证资料。
七、注意事项与存储
- 存放时避免潮湿、高温和强酸碱环境，长期库存建议防潮包装。
- 贴装前如有潮湿敏感等级（MSL）要求，应根据元件标签与包装说明进行烘干处理。
- 在电路设计中留出合理的功率与电压裕量，避免长期在额定极限条件下工作以延长寿命。
如需完整电气特性、功率降额曲线、热阻和可靠性测试数据，请索取 UNI-ROYAL（厚声）官方数据手册或样品检测报告，以便在系统设计中做更精确的评估。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
