WMSIC Electronic Components

UNI-ROYAL 0402WGF2103TCE

Model0402WGF2103TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF2103TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF2103TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
210kΩ
Electronic Component
10
Electronic Component
BM0263477379
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF2103TCE 贴片厚膜电阻产品概述

一、产品基本定位与身份标识

0402WGF2103TCE是UNI-ROYAL(厚声)推出的小尺寸高精度厚膜贴片电阻,型号各段含义清晰:

  • “0402”为英制封装尺寸(对应公制1.0mm×0.5mm);
  • “WGF”是厚声针对小型化电阻的系列代码;
  • “2103”为阻值编码(210×10³Ω=210kΩ);
  • “TCE”后缀对应精度(±1%)、温度系数(±100ppm/℃)等核心参数。

该产品定位于低功耗、高密度电路的信号调理与功率限制场景,兼顾性能与成本优势。

二、核心电气参数详解

核心参数直接决定应用边界,关键参数及实际意义如下:

  1. 阻值:210kΩ
    中高阻值范围,适配分压、限流、RC滤波等场景(如传感器信号采样分压、音频电路偏置);
  2. 精度:±1%
    工业级常规高精度(高于±5%普通级),可避免信号调理电路的分压/限流误差(如传感器信号幅值偏差);
  3. 额定功率:62.5mW(0.0625W)
    0402封装典型小功率设计,适配低功耗终端(物联网节点、智能穿戴),实际功率需≤额定值(210kΩ时最大电流≈0.54mA);
  4. 额定工作电压:50V
    直流/交流峰值电压限制,避免过压击穿(需同时结合功率,优先满足功率约束);
  5. 温度系数:±100ppm/℃
    温度每变化1℃,阻值变化±21Ω(210kΩ×100ppm),满足宽温下的阻值稳定性;
  6. 工作温度:-55℃~+155℃
    覆盖汽车级/工业级宽温场景(户外传感器、车载模块),远超商业级0~70℃限制。

三、封装与工艺特点

1. 0402封装的高密度适配性

公制尺寸1.0mm×0.5mm,厚度约0.3mm,可大幅提升PCB布线密度,适配智能手机、智能手表等小型化终端的高密度电路设计。

2. 厚膜工艺的性能平衡

采用丝网印刷+高温烧结工艺:

  • 氧化铝陶瓷基底:提供良好热稳定性,降低温度对阻值的影响;
  • 钌基厚膜层:耐磨损、抗冲击,相比薄膜电阻成本更低,相比绕线电阻体积更小;
  • 无铅电极(Sn/Ag/Cu):适配回流焊、波峰焊,焊接可靠性高。

四、典型应用场景

结合参数与封装特性,该产品主要应用于:

  1. 消费电子:智能手机音频前级分压、摄像头传感器滤波;
  2. 物联网终端:温湿度/运动传感器节点的限流与偏置电阻;
  3. 工业控制:小型PLC、远程I/O模块的信号链路电阻(宽温适配);
  4. 汽车电子:车载仪表盘背光调节、胎压监测辅助电路;
  5. 医疗电子:血糖仪、血压计的信号放大前级电阻(高精度需求)。

五、可靠性与环境适应性

产品通过多项行业可靠性测试:

  • 温度循环:-55℃→+155℃循环500次,阻值变化率≤0.2%;
  • 高湿测试:85℃/85%RH放置240小时,阻值漂移≤0.3%;
  • 机械振动:10~2000Hz、1.5g振动10小时,无开路/短路;
  • 长期老化:125℃放置1000小时,阻值变化率≤0.5%。

六、品牌与质量优势

UNI-ROYAL(厚声)作为国内被动元器件龙头,该产品具备:

  1. 认证齐全:ISO9001、ISO/TS16949(汽车级)、RoHS、REACH;
  2. 一致性优异:批量阻值偏差≤±1%,温度系数一致性≤±10ppm/℃;
  3. 可追溯性:批次唯一编码,便于质量追溯;
  4. 环保合规:无铅无卤设计,适配全球市场。

总结:0402WGF2103TCE是专为小尺寸、高精度、宽温场景设计的厚膜贴片电阻,平衡性能与成本,广泛适配消费电子、物联网、工业控制等多领域低功耗高密度电路需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.