WMSIC Electronic Components

UNI-ROYAL 0603WAF1242T5E

Model0603WAF1242T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF1242T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF1242T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
12.4kΩ
Electronic Component
10
Electronic Component
BM0257245676
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF1242T5E 产品概述

一、产品简介

0603WAF1242T5E 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,封装规格为 0603(1608 英制)。标称阻值 12.4 kΩ,精度 ±1%,额定功率 100 mW,工作电压 75 V,温度系数(TCR)±100 ppm/℃,工作温度范围 -55℃ 至 +155℃。该型号面向体积受限的高密度贴片电路,兼顾小型化与稳定性,适用于手持设备、消费电子、通讯终端及各种精密测量电路中的分压、偏置与限流等应用。

二、主要性能与特点

  • 阻值:12.4 kΩ,精度 ±1%,满足中高精度电阻配网需求。
  • 热漂:±100 ppm/℃,在宽温度区间内保持较好阻值稳定性。
  • 功率与电压:额定功率 100 mW(在规定环境条件下),最高工作电压 75 V。
  • 温度范围:-55℃~+155℃,适应汽车级温度边界以外的一般工业级应用环境。
  • 封装:0603(1608),适合高密度 PCB 贴装与自动化回流工艺。
  • 制程:厚膜工艺,成本效益好,批量一致性稳定。

三、可靠性及使用建议

  • 功率降额:100 mW 为常温下额定值,建议在高温环境或密集布板时按照厂方降额曲线执行;在接近上限温度时应采取散热或降额措施以延长寿命。
  • 焊接与工艺:兼容无铅回流焊工艺;推荐遵循 JEDEC 标准回流曲线,避免超温或长期过热。
  • 贴装注意:0603 尺寸较小,贴片时注意避免过度机械应力导致端电极裂纹或基体破损;推荐合理焊盘尺寸与焊膏量,减少 tombstoning 风险。
  • 储存与处理:避免潮湿环境长期暴露,开卷后建议在规定时间内使用或回潮处理;搬运时避免挤压、摔落及强震动。

四、典型应用场景

  • 移动终端与便携式设备的偏置/分压网络。
  • 通信设备的阻抗匹配与滤波回路。
  • 工业控制与仪表中的精密分流与参考电阻。
  • 消费电子、家用电器及物联网模块等对体积和成本敏感的场合。

五、包装与选购说明

本产品常见为卷带(Tape & Reel)包装,适配自动贴片机。有关最小包装数量、卷盘尺寸(7" / 13")及具体出货时间、认证资料(如 RoHS)等,请在采购时向 UNI-ROYAL 或授权分销商确认,以获取完整规格书与可靠性试验报告。

若需更详细的电气特性曲线、热降额曲线或焊接工艺建议,我可以帮您整理或匹配替代型号。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.