WMSIC Electronic Components

UNI-ROYAL 0201WMF1202TEE

Model0201WMF1202TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF1202TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF1202TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
12kΩ
Electronic Component
10
Electronic Component
BM0257242277
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF1202TEE 产品概述

一、产品简介

0201WMF1202TEE 是 UNI-ROYAL(厚声)系列的贴片厚膜电阻,阻值 12kΩ,精度 ±1%,额定功率 50mW,额定工作电压 25V,适用于超小型高密度 PCB 设计与精密电路。该型号以微小封装、稳定的电气特性和宽温度范围为特点,常用于便携式终端、可穿戴设备、物联网节点和精密传感前端等空间受限但对阻值可靠性有要求的场合。

二、主要电气与热学参数

  • 阻值:12 kΩ(标称)
  • 精度:±1%(高精度配合精密分压、滤波使用)
  • 额定功率:50 mW(0201 封装受限的功率等级,需注意热管理)
  • 额定工作电压:25 V(注意电压与功率关系)
  • 温度系数(TCR):±200 ppm/℃(在温度变化时阻值漂移较小,适合一般精度应用)
  • 工作温度范围:-55 ℃ ~ +155 ℃

补充说明:在实际设计中建议按功率限制进行余量设计。按 P=V^2/R 计算,50 mW 对应的允许最大稳态电压约为 sqrt(0.05×12000) ≈ 24.5 V;因此在接近 25 V 时应考虑适当降额或短时使用。

三、封装与制造工艺

  • 封装:0201(超小型表贴),适合高密度布板。
  • 制造工艺:厚膜(厚膜电阻),以陶瓷基板上印刷电阻膜并烧结而成,工艺成熟,成本与量产性能优良。
    厚膜结构在机械强度与焊接可靠性上表现稳定,但由于体积小,热阻较大,散热能力有限,应注意热应力与电功率的匹配。

四、典型应用

  • 手机、可穿戴设备、蓝牙/无线模块等空间受限的电子产品;
  • 精密分压电路、模拟前端、滤波网络和偏置电路;
  • 物联网终端与传感器节点中的被动元件阵列;
  • 需要高电阻值与 1% 精度场合的批量化应用。

五、布局、焊接与使用建议

  • PCB 设计:由于 0201 尺寸极小,建议参考制造商的推荐焊盘尺寸与过孔布局,保证焊接可靠性与可检视性;焊盘过大或过小均会影响焊点质量。
  • 回流焊:遵循无铅回流曲线,注意加热/冷却速率,以防组件滑移或开裂;小型电阻热质量低,易受回流曲线偏差影响。
  • 功率与散热:尽量避免长时间在接近额定功率条件下运行;对于连续高功率工况,采用降额或分散功率方案。
  • 储存与搬运:使用防潮包装,避免潮湿与机械碰撞;在贴片过程注意防静电与精密搬运。

六、可靠性与采购提示

该厚膜电阻适合量产与自动化贴装场景。采购时请确认包装卷盘、出货检验(阻值、容差、外观)及是否满足您项目所需的环境与认证要求(如有特定温湿度或寿命测试要求,可向厂商索取加速寿命与可靠性报告)。

总体而言,0201WMF1202TEE 在尺寸受限且需要 1% 精度的产品中具有很高的集成度和适用性,但需在电压、功率和热管理上给予充分考虑以确保长期稳定工作。

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