WMSIC Electronic Components

UNI-ROYAL 0805W8F560JT5E

Model0805W8F560JT5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8F560JT5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8F560JT5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
56Ω
Electronic Component
1
Electronic Component
BM0257341379
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8F560JT5E 产品概述

一、产品简介

0805W8F560JT5E 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,封装规格为0805(公制 2012),标称阻值 56Ω,阻值精度 ±1%,额定功率 125mW,工作电压最高 150V。该元件适用于体积受限且对阻值精度有一定要求的电子设备中,兼顾成本与可靠性。

二、主要规格参数

  • 类型:厚膜贴片电阻(Chip, Thick Film)
  • 封装:0805(约 2.0 × 1.25 mm)
  • 阻值:56Ω(标称)
  • 精度:±1%
  • 额定功率:125 mW(环境温度和散热条件依数据手册为准)
  • 最大工作电压:150 V
  • 温度系数:±100 ppm/℃
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 品牌:UNI-ROYAL(厚声)

三、关键特性与优势

  • 精度高:±1% 精度满足多数精密模拟与信号处理场合的阻值要求。
  • 小尺寸:0805 封装有利于高密度贴片布局,适合便携和轻薄型产品。
  • 良好温度稳定性:±100 ppm/℃ 的温度系数适用于中等温变环境,保证信号稳定性。
  • 较高工作电压:150V 的耐压能力使其在电压分压、测量前端等场合更为可靠。
  • 成本与可制造性兼具:厚膜工艺在批量生产中具有成本优势,并适配常见 SMT 贴片工艺。

四、典型应用场景

  • 信号耦合与偏置网络(滤波、耦合、偏置电阻)
  • 电压分压与测量前端(适用于中低功率电压检测)
  • 模拟电路中的负载与限流(高精度低功耗场合)
  • 工业控制、通信终端、消费电子中的通用贴片阻值需求

五、可靠性与环境适应性

本系列电阻工作温度范围宽(-55 ℃ 至 +155 ℃),适应工业级温度要求;厚膜结构在抗振、抗冲击方面表现稳定。对于长时间使用或极端环境(高温、潮湿、盐雾等),建议参考厂商的加速寿命与环境试验数据(如焊接热冲击、湿热、振动、温度循环等),并在关键应用中做必要的老化与可靠性验证。

六、封装与采购信息

该型号通常以贴片卷带(Tape & Reel)方式供货,便于 SMT 贴装生产线直接使用。产品型号中的“0805”对应封装尺寸,“560”代表 56Ω,其他字母与数字为厂商系列与包装代码,具体含义请以 UNI-ROYAL 数据表为准。批量采购时建议核对厂家出货包装与数量规格。

七、PCB 布局与焊接建议

  • 焊盘设计应保证两端焊点对称,焊膏量适中以避免 tombstone(立碑)或过量焊锡短路。
  • 遵循厂商和 IPC 标准的回流焊温度曲线,避免超出元件允许的热应力。
  • 对于需要高精度阻值的电阻,建议在电阻附近预留温度敏感元件的合理距离,避免自热与热串扰。
  • 在机械应力较大区域应采取固定或保护措施,防止焊点疲劳。

八、注意事项

  • 额定功率 125mW 为在规定环境与散热条件下的参考值,高温时需考虑功率降额;如需在高功率或高温环境下长期工作,请与厂商确认降额曲线。
  • 在高电压应用中,关注爬电距离和 PCB 设计以避免击穿或表面泄漏。
  • 如对噪声、长期漂移、清洗溶剂兼容性有特殊要求,应向供应商索取详细规格书与测试报告。

如需完整数据手册(包含尺寸图、热降额曲线、环境试验结果及包装信息),建议联系 UNI-ROYAL 厂家或授权分销商获取原厂资料,以便在设计与量产时做精确验证。

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