WMSIC Electronic Components

UNI-ROYAL 0402WGJ0331TCE

Model0402WGJ0331TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGJ0331TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGJ0331TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
330Ω
Electronic Component
50
Electronic Component
BM0249744768
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGJ0331TCE 产品概述

一、产品简介

0402WGJ0331TCE 是 UNI-ROYAL(厚声)出品的一款0402封装厚膜贴片电阻。标称阻值为 330Ω,精度 ±5%,额定功率 62.5mW(1/16W),最高工作电压 50V,温度系数(TCR)±100ppm/℃,工作温度范围 -55℃ 至 +155℃。该器件面向高密度贴装与轻负载电路,兼顾尺寸缩小与基本电气可靠性要求。

二、主要特性

  • 封装:0402(典型外形约 1.0mm × 0.5mm),适合高密度 SMT 布局。
  • 阻值/精度:330Ω,±5%,满足普通分压、限流及阻抗匹配等应用。
  • 功率与电压:额定功率 62.5mW,最高工作电压 50V,适用于低功耗信号和电源旁路场合。
  • 温度特性:TCR ±100ppm/℃,在广泛温度下保持稳定性能。
  • 温度范围:-55℃~+155℃,可在工业级温度环境内工作。

三、电气性能建议

本型号为厚膜结构,适合一般电子产品的信号与功率分配使用。因额定功率较小,设计时应考虑热降额及环境散热:在印刷电路板上紧密布置或高功率密度区域,应避免长期满载运行。工作电压上限 50V,不宜用于高压隔离场合。

四、封装与工艺兼容

0402WGJ0331TCE 适用于自动贴片与回流焊工艺。为保证焊接质量,建议按照制造商提供的回流曲线或行业标准进行焊接,避免反复温升或过高峰值温度。器件适配 SMT 托盘/盘带供料,利于高速贴装生产线。

五、典型应用场景

  • 手机、可穿戴设备等消费电子的信号限流与分压电路。
  • 物联网传感节点与低功耗模组中的电阻网络。
  • 汽车电子非关键低功耗信号路径(在满足车规验证前提下)。
  • 工业控制与仪表的阻值配对与滤波网络(注意功率与热管理)。

六、选型与注意事项

  • 若电路工作温度或功耗接近器件极限,应选择更高功率或更低TCR的电阻。
  • 在高精度测量或温度敏感应用,±5% 与 ±100ppm/℃ 的组合可能不满足要求,应考虑更高精度或薄膜产品。
  • 设计时参考实际工作环境进行功率降额和散热评估,避免长期超额运行影响寿命。

七、小结

0402WGJ0331TCE 是一款面向高密度封装与常规信号应用的厚膜贴片电阻,凭借小尺寸与稳定的电气特性,适合消费电子、物联网与一般工业电子产品中对体积和成本有要求的场合。选用时应关注功率降额、焊接工艺和具体应用的精度/温漂需求,确保长期可靠运行。若需器件样品、详细包装或回流曲线,请联系 UNI-ROYAL 厂家或授权代理获取完整数据手册。

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