WMSIC Electronic Components

UNI-ROYAL 0603WAF2493T5E

Model0603WAF2493T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF2493T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF2493T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
249kΩ
Electronic Component
1
Electronic Component
BM0257341776
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF2493T5E 产品概述

一、产品简介

0603WAF2493T5E 是 UNI-ROYAL(厚声)系列的厚膜贴片电阻,封装为 0603(约 1.6 mm × 0.8 mm),阻值 249 kΩ,精度 ±1%,额定功率 100 mW,最大工作电压 75 V,温度系数(TCR)±100 ppm/℃,工作温度范围 -55℃ 至 +155℃。该器件属于通用厚膜电阻,适用于高密度表贴电路中的分压、偏置与滤波场合。

二、主要参数(要点)

  • 阻值:249 kΩ ±1%
  • 功率额定:100 mW(室温额定值)
  • 最大工作电压:75 V
  • TCR:±100 ppm/℃(约 0.01%/℃)
  • 工作温度:-55℃ ~ +155℃
  • 封装:0603(表面贴装)
  • 工艺:厚膜(满足一般通用稳定性与成本要求)

三、电气特性与计算说明

  • 根据功率与阻值计算的理论电压上限 V = sqrt(P·R) ≈ sqrt(0.1·249000) ≈ 158 V,但器件标称最大工作电压受限为 75 V,因此在实际应用中不得超过 75 V。
  • 在 75 V 下的实际消耗功率约为 P = V^2/R ≈ 22.6 mW,低于额定 100 mW,符合安全使用。
  • TCR 为 ±100 ppm/℃,即温度每变化 1℃,阻值变化约 0.01%;举例:温差 100℃ 时阻值变化约 1%。

四、温度与稳定性注意事项

  • 宽温范围(-55℃ ~ +155℃)适合工业级应用,但在高温环境下应考虑功率降额与寿命影响。
  • 初始阻值公差 ±1% 加上温漂在极端温度跨度下可能引起累计偏差(例如 210℃ 全跨度下温漂贡献约 2.1%),设计时应留有余量或采取温度补偿措施。

五、封装与机械特性

  • 0603 小尺寸适合高密度 PCB 布局,节省空间。
  • 厚膜结构对焊接与机械应力较敏感,焊接时避免过大拉伸或弯折,应保证焊盘与器件之间的良好支撑。

六、贴装与回流焊建议

  • 兼容常规无铅回流工艺;推荐遵循 PCB 制造与 SMT 工艺规范进行回流温度曲线控制(避免剧烈温度梯度与过长的高温持时)。
  • 建议使用标准 0603 的 land pattern,回流后检查焊点润湿与端点完整性。避免在焊接前后进行强烈超声清洗或机械冲击。

七、典型应用场景

  • 各类消费电子与工业控制板的分压、偏置电路;
  • 高频信号路径中的阻抗匹配(视具体电路要求);
  • 需要小体积、高密度贴片的测量与传感前端(在满足电压与温漂限制下)。

八、包装与质量保障

  • 一般以卷带(Tape & Reel)形式供货,适配自动贴片机;具体包装数量与代码可咨询供应商。
  • 建议在采购前索取完整数据表(datasheet)以确认环境降额曲线、可靠性试验与认证信息,并按实际应用进行必要的老化与检验。

如果需要,我可根据您的具体电路环境(工作电压、环境温度、布局空间)帮您做更精确的功率/电压校核与布局建议。

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