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UNI-ROYAL 0201WMF2001TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF2001TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF2001TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 2kΩ
- Electronic Component
- 10
- Electronic Component
- BM0257242270
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF2001TEE 产品概述
一、产品概述
0201WMF2001TEE 为 UNI-ROYAL（厚声）出品的贴片厚膜电阻，封装尺寸 0201，标称阻值 2.00 kΩ，公差 ±1%，额定功率 50 mW，最高工作电压 25 V。工作温度范围宽 (-55 ℃ ~ +155 ℃)，温度系数为 ±200 ppm/℃，适用于超小型、高密度电路的精密分压、偏置与信号处理场合。
二、主要电气与环境参数
- 阻值：2 kΩ（2000 Ω） ±1%
- 功率：50 mW（额定，环境温度参考值）
- 最大工作电压：25 V
- 温度系数（TCR）：±200 ppm/℃
- 工作温度：-55 ℃ ~ +155 ℃
- 封装：0201（典型尺寸约 0.6 mm × 0.3 mm）
- 制程：厚膜（Thick Film）
说明：按 TCR ±200 ppm/℃，例如从 25 ℃ 升到 85 ℃（ΔT=60 ℃）时，阻值最大变化约 1.2%，需在高温工况下考虑该偏差与公差叠加影响。
三、性能特点与应用场景
- 高密度贴装：0201 超小封装，节省 PCB 面积，适合手机、可穿戴、蓝牙模块与 IoT 终端等空间受限设备；
- 精度较高：±1% 满足常见模拟、分压与反馈回路的精密要求；
- 宽温度范围：适应工业级及部分严苛温度环境；
- 低功耗应用：50 mW 定额适合信号级与低功耗电路，非大电流功率分流用途。
四、可靠性与焊接建议
- 焊接：建议按 J-STD-020/IPC 推荐回流曲线，峰值温度不超过 260 ℃，高温区时间建议尽量缩短（典型峰值持续时间 ≤10 s）；
- 降额：环境温度上升时需按厂商降额曲线处理，一般在 +70 ℃ 之后开始线性降额至最高工作温度；
- 备料与储存：防潮包装保存，避免长时间暴露在高湿或化学腐蚀性气氛中；
- 装配：0201 体积小，贴装与首件检测需使用高精度贴片机与光学检测，焊盘设计建议参考 IPC 标准或厂方推荐封装库。
五、选型与替代注意
选择时注意实际工作电压与功耗不得超过规格限制，尤其在并联/串联网络中验证每只电阻承受电压与分配功率。若电路存在较大温度漂移敏感性，可考虑更低 TCR（例如 ±100 ppm/℃ 或更优）或提高阻值精度以满足系统稳定性要求。
六、包装与采购
该型号常见以卷带（Tape & Reel）方式供货，便于贴装加工。具体包装数量、最低订购量与质量认证可向供应商或授权代理咨询确认。
如需封装尺寸图、焊盘推荐值、详细降额曲线或可靠性测试报告，可提供进一步索取以便在 PCB 布局与热设计中准确应用。
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