WMSIC Electronic Components

UNI-ROYAL 4D03WGJ0510T5E

Model4D03WGJ0510T5E
Package0603*4
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 4D03WGJ0510T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
4D03WGJ0510T5E
Electronic Component
1
Package
0603*4
Electronic Component
Resistor Array
Electronic Component
±5%
Electronic Component
0.029g
Electronic Component
51Ω
Electronic Component
8
Electronic Component
1
Electronic Component
BM0257628175
Electronic Component
±200ppm/℃
Resistor
4
Power
62.5mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

4D03WGJ0510T5E 产品概述

一、产品简介

4D03WGJ0510T5E 为 UNI-ROYAL(厚声)推出的四位排阻网络,封装形式为 0603*4(8 引脚)。每个阻值为 51Ω,公差 ±5%,单元功率额定 62.5 mW,温度系数(TCR)为 ±200 ppm/℃。该器件适用于需要多路一致阻值且节省 PCB 面积的表面贴装电路设计。

二、主要特性

  • 四通道排阻,8 引脚 0603x4 紧凑封装,便于高密度布局。
  • 单个电阻 51Ω,精度 ±5%,适用于一般阻抗匹配与限流场合。
  • 额定功率 62.5 mW/通道,低功耗设计;TCR ±200 ppm/℃,温度升高 100℃ 时阻值约变化 2%。
  • 表面贴装,兼容无铅回流焊工艺,适合自动化贴片生产与高速组装。

三、典型应用场景

  • 数字/模拟信号线的终端或阻抗匹配(低功率场合)。
  • 多路 LED 小电流限流与分流网络。
  • 信号分配、上拉/下拉网络、分压或去耦阻阵列。
  • 便携式与消费类电子中对体积与一致性要求较高的电阻网络。

四、设计与布局建议

  • 建议将排阻放置在相关信号源或接口附近,减小走线长度与寄生电感。
  • 对于靠近热源或高功率器件的布局,应考虑功率降额与散热通道,尽量避免铜箔大面积连接到排阻两端以降低焊点热阻影响。
  • 焊盘设计保持对称,遵循 0603 标准封装的推荐焊盘尺寸与回流曲线,避免过热或冷焊。
  • 若用于高频或差分线匹配,应评估封装引起的寄生电容与电感对信号完整性的影响。

五、可靠性与采购注意

  • 在实际应用中,请参考厂方完整技术资料(datasheet)确认额定工作温度范围、功率随温度的降额曲线及焊接工艺参数。
  • 常见包装为防潮卷带(具体以供应商出具为准),收货后建议按电子元件存储规范保存并在规定时间内使用。
  • 批次一致性、温漂与长期稳定性在精密应用场合需通过样件评估确认。

六、总结

4D03WGJ0510T5E 是一款适合中低功率、多通道、追求体积与一致性设计的 4 位排阻网络。凭借 0603x4 的紧凑封装与 51Ω 的标准阻值,它在消费电子、便携设备和高密度电路板中具有较高的实用性。为保证性能与可靠性,设计和采购时应结合厂方 datasheet 做热管理与工艺适配。

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