WMSIC Electronic Components

UNI-ROYAL 0805W8J0152T5E

Model0805W8J0152T5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8J0152T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8J0152T5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.027g
Electronic Component
1.5kΩ
Electronic Component
1
Electronic Component
BM0257628154
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8J0152T5E 产品概述 — UNI-ROYAL(厚声)0805贴片电阻 1.5KΩ ±5% 1/8W

一、产品简介

0805W8J0152T5E 是 UNI-ROYAL(厚声)系列的一款厚膜贴片电阻,规格为 0805(公制 2012)。标称阻值 1.5kΩ,精度 ±5%(J),额定功率 1/8W(125mW),工作电压 150V,温度系数 ±100ppm/℃,工作温度范围宽至 -55℃ ~ +155℃。该产品适用于体积受限且对成本和可靠性有综合要求的各类电子设备。

二、主要特性

  • 厚膜工艺,成本效益高,适合大批量生产;
  • 0805 小体积封装,适用于高密度贴装板设计;
  • 额定功率 125mW,满足一般信号和小功率电路需求;
  • ±5% 精度适合通用分压、偏置、拉/下拉等场合;
  • 宽温度范围(-55℃~+155℃)适应多种环境条件;
  • 温度系数 ±100ppm/℃,在温漂敏感度一般的场景表现稳定。

三、电气与环境参数(关键项)

  • 阻值:1.5kΩ
  • 精度:±5%(J)
  • 额定功率:125mW(1/8W)
  • 最大工作电压:150V
  • 温度系数(TCR):±100ppm/℃(典型)
  • 工作温度:-55℃ ~ +155℃
  • 制造工艺:厚膜(Thick Film)
  • 封装:0805(2.0 × 1.25 mm)

四、封装与可靠性

0805(2012公制)封装在体积与散热之间做了较好折中,适合自动贴装与回流焊工艺。厚膜电阻对瞬时冲击和振动具有良好适应性,长期使用时建议按电阻功率的推荐热降额规则设计电路,避免长期满载工作以提高可靠性和寿命。

五、典型应用场景

  • 数字/模拟电路中的偏置、分压和限流电阻;
  • 信号处理与滤波电路的阻性元件;
  • LED 驱动的限流(低/中亮度场景);
  • 手持设备、消费电子、家电控制板和工业控制中的通用电阻需求;
  • IoT 终端与传感器模块中的常规阻值配置。

六、设计与使用建议

  • 为保证寿命与稳定性,建议在实际工作中对电阻进行功率降额设计(例如尽量在额定功率的 60%~80% 以下长期运行);
  • 安装采用常规贴片回流焊流程,避免超出制造商推荐的温度和时间窗口;回流焊后应避免强机械应力或过度弯曲电路板;
  • 在对温漂或低阻差要求较高的场合,考虑使用更低 TCR 或更高精度的电阻;对冲击、潮湿或高可靠性要求严格的项目,请与供应商确认额外的认证或测试数据。

七、包装与订购提示

产品通常以卷盘(Reel)方式供货,方便 SMT 自动贴装。订购时请确认完整料号(示例:0805W8J0152T5E)、订购数量和交货周期;若有特殊包装、放电管制或出厂测试要求,请在下单时注明。

八、常见替代与选型参考

若需更高精度或更小温漂,可考虑金属膜或更低 TCR 的薄膜电阻;若功率需求更高,可选 1206 或 1210 等更大封装;对高压或高可靠性应用,选型时应参考更严格的电气及环境认证数据。

如需本型号的样品规格书、耐焊性/耐潮测试报告或在特定应用中的性能评估,我可以帮助整理并给出更具体的选型建议。

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