WMSIC Electronic Components

UNI-ROYAL 0805W8F680JT5E

Model0805W8F680JT5E
Package0805
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0805W8F680JT5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0805W8F680JT5E
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.027g
Electronic Component
68Ω
Electronic Component
1
Electronic Component
BM0257341434
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805W8F680JT5E 产品概述

一、产品简介

0805W8F680JT5E 是 UNI-ROYAL(厚声)系列的贴片厚膜电阻,标称阻值 68Ω,阻值精度 ±1%,额定功率 125mW,适用于空间受限且对精度有中高要求的表面贴装电路。该器件在宽温度范围内保持稳定的阻值特性,适配常见电子制造流程。

二、主要参数

  • 电阻类型:厚膜电阻
  • 阻值:68Ω
  • 精度:±1%(F)
  • 额定功率:125mW(常温)
  • 最高工作电压:150V
  • 温度系数(TCR):±200 ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 封装尺寸:0805(约 2.0 × 1.25 mm)

三、性能特点

该型号具有良好的阻值稳定性与制造一致性,TCR 在 ±200 ppm/℃ 范围内,适合一般信号与偏置网络应用。厚膜工艺使其抗浪涌和机械应力能力较好,经过常规环境与寿命试验后性能可靠。采用适配 SMT 的终端处理,兼容无铅回流焊工艺。

四、外形与封装

0805 封装尺寸小巧,便于高密度贴装与自动化生产。常规为卷带(Tape & Reel)包装,便于 SMT 贴装机取放。焊盘设计与推荐铺铜应参考厂商资料,以确保焊点可靠性与热循环性能。

五、典型应用

适用于便携消费电子、通信设备、工业控制、信号调理与功率分配等场景,常用作限流、偏置、阻抗匹配与分压等位置。因额定功率和工作电压的限制,不适合高功率或高压直流主回路。

六、焊接与储存建议

兼容主流无铅回流曲线(详见生产厂商的回流温度限制),建议遵循 IPC/JEDEC 等焊接规范以避免过热导致阻值漂移。储存环境建议干燥、无腐蚀性气体,并在建议的保质期内使用以保证贴装可靠性。

七、选型与注意事项

选用时应确认额定功率在实际工作温度下的退让(derating)曲线及最大工作电压边界,评估浪涌电流和长期负载寿命。对温漂、噪声或精度有更严格要求的场合,可考虑薄膜或金属膜高精度替代件。最终设计应以厂方完整规格书和可靠性数据为准。

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