WMSIC Electronic Components

UNI-ROYAL 0201WMJ0105TEE

Model0201WMJ0105TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMJ0105TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMJ0105TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
1MΩ
Electronic Component
50
Electronic Component
BM0257242285
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMJ0105TEE 产品概述

一、产品简介

0201WMJ0105TEE 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,封装尺寸为 0201(约 0.6 mm × 0.3 mm),阻值 1 MΩ,额定功率 50 mW,公差 ±5%,温度系数 ±200 ppm/℃,额定工作电压 25 V,工作温度范围 -55℃ 至 +155℃。该款元件针对超小型化、高密度布板场景,兼顾尺寸优势与通用电气性能,适合批量贴片生产。

二、主要性能要点

  • 阻值:1 MΩ,适用于高阻抗电路、偏置和下拉/上拉网络。
  • 精度:±5%,满足一般模拟与数字电路的容差要求。
  • 功率:50 mW,功耗较小,适用于信号级与低功率应用;在高环境温度下需参照厂商降额曲线。
  • 工作电压:25 V,超过此电压可能引起介质击穿或阻值漂移,应遵守额定电压限制。
  • 温度特性:±200 ppm/℃,温漂中等,对温度敏感度较高的精密电路需谨慎选型。
  • 工作温度范围:-55℃~+155℃,满足工业级温度要求。

三、典型应用场景

  • 移动终端、可穿戴设备等对体积和重量有严格要求的消费电子;
  • 各类传感器前端的偏置、参考回路与分压网络;
  • 高频、射频旁路与耦合电路(在阻值和温漂允许的前提下);
  • 工业控制与仪表中需要高阻值但不要求高精度的场合。

四、使用与安装建议

  • 推荐使用自动贴装与回流焊工艺,具体回流温度曲线请参照厂商数据手册;
  • 留意 PCB 布局中高阻值器件的爬电距离和泄漏路径,避免靠近潮湿或污染源;
  • 对于长期稳定性要求高的电路,请考虑使用更低 TCR 或更高精度的薄膜电阻替代;
  • 避免在超过额定功率或额定电压的工况下长期工作,以免引起长期漂移或失效。

五、可靠性与储存

  • 在常规良好封装条件下,建议密封干燥保存,避免潮气和腐蚀性气体影响;
  • 建议在推荐的保质期内使用并遵循厂商的抗湿、焊接及清洗工艺说明;
  • 对关键应用进行批样加速老化与环境应力测试,以验证在目标工况下的长期可靠性。

六、选型提示

  • 若电路对温漂、噪声或长期稳定性有更高要求,建议比较薄膜或金属膜系列产品;
  • 若需更高电压或更大功率,应选择相应封装或额定更高的型号;
  • 订购时确认包装形式(卷带、盘带)与贴片机兼容性,便于生产装配。

0201WMJ0105TEE 以其超小体积和标准电气指标,适合追求高密度装配且对成本敏感的一般电子产品设计。欲获取更详细的尺寸图、回流曲线与可靠性数据,请参考厂方完整数据手册或联系 UNI-ROYAL 技术支持。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.