WMSIC Electronic Components

UNI-ROYAL 0402WGF270JTCE

Model0402WGF270JTCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF270JTCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF270JTCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
27Ω
Electronic Component
10
Electronic Component
BM0257242577
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF270JTCE 产品概述

一、产品简介

0402WGF270JTCE 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,阻值 27Ω,精度 ±1%,额定功率 62.5mW,0402 封装(公制:1005 英制:0402)。该器件以厚膜工艺制成,具有尺寸小、可靠性高、适用于高密度贴片电路的特点,适合精密分流、限流与衰减等应用场景。

二、主要技术参数

  • 阻值:27Ω
  • 精度:±1%(±0.01R)
  • 额定功率:62.5 mW(常温下)
  • 最大工作电压:50 V
  • 温度系数(TCR):±100 ppm/°C
  • 工作温度范围:-55 °C ~ +155 °C
  • 封装:0402(厚膜)
  • 品牌:UNI-ROYAL(厚声)
  • 描述:贴片电阻 62.5mW 27Ω ±1% 厚膜电阻

三、电气特性与设计要点

  • 在额定功率下的最大允许电流 Imax ≈ sqrt(P/R) ≈ 48 mA;对应电压约 V≈1.30 V。
  • 虽然器件标称最大工作电压为 50 V,但在接近额定功率时器件两端实际电压远低于此值;请避免大幅冲击、电压突变或浪涌。
  • ±100 ppm/°C 的 TCR 表示温度变化对阻值影响较小,适合对温漂有一定要求的电路,但高精度测量仍需考虑温升和环境温度影响。
  • 由于功率较小,设计时需注意热阻和周围元件散热,避免长期在高温环境中工作导致功率降额或漂移。

四、可靠性与环境适应

  • 工作温度从 -55 °C 到 +155 °C,覆盖工业级温度范围,适合大多数工业电子和消费类产品。
  • 厚膜工艺对机械应力和焊接热循环具有良好耐受性,但应遵循制造商推荐的焊接工艺与热循环规范以保证长期可靠性。
  • 建议采用符合 RoHS 的无铅工艺进行回流焊接,如需更详细的可靠性数据(湿热、温度循环、机械冲击等),请参考厂方试验报告或技术说明书。

五、典型应用

  • 小信号限流、分流电路(低电流场合)
  • 精密电压分压、传感器前端阻抗调节(对温漂有中等要求的场合)
  • 移动设备、可穿戴、智能卡与高密度 PCB 中的空间受限电路
  • 各类终端产品与工业控制板低功耗电路

六、封装与订购信息

  • 封装:0402(适配自动贴片机与常规 SMT 制程)
  • 推荐订购型号:0402WGF270JTCE(请以厂方最新物料编码与包装信息为准)
  • 供货形式通常为卷带包装(Tape & Reel),便于 SMT 自动化生产;订购时请确认卷盘数量、包装批号与生产批次。

七、使用与焊接建议

  • 建议采用无铅回流焊工艺,控制回流峰值温度在行业推荐范围内(参照焊锡材料和 PCB 工艺要求),避免长时间高温导致阻值漂移。
  • 贴装时避免过大的剪切力与机械冲击,焊膏用量与焊盘设计应与 0402 尺寸匹配以减少焊接缺陷。
  • 对于要求长期稳定性的应用,建议在设计阶段预留额定功率的安全裕量,并考虑周围器件对散热的影响。

八、储存与搬运

  • 储存环境建议干燥、避免潮湿及强腐蚀性气体;长期储存时遵循厂方包装与防潮要求。
  • 贴装前如产品经过吸湿,应根据厂家建议进行回烘处理以防回流焊时发生爆裂、焊接缺陷。

结论:0402WGF270JTCE 是一款适用于高密度、低功耗设计的工业级厚膜贴片电阻,结合 ±1% 精度与 ±100 ppm/°C 的温漂,适合多种精密与空间受限场合。设计时需关注热管理与功率降额,以确保长期稳定工作。若需更详尽的电气特性曲线、焊接曲线或可靠性测试报告,请联系供应商或索取厂方数据手册。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.