Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
TC0325B1002T5F 是 UNI-ROYAL(厚声) 系列高精度薄膜贴片电阻,封装为 0603(公制 1608)。标称阻值 10kΩ,额定功率 100mW,精度 ±0.1%,温度系数(TCR)为 ±25ppm/℃,最大工作电压 75V。该型号专为对精度与稳定性有较高要求的精密电路设计。
本品采用陶瓷基体作为载体,薄膜电阻层通过高均匀性金属(或合金)薄膜沉积并经精密激光修整得到目标阻值。表面有保护釉层以提高抗潮湿与机械强度,端接处为可焊性良好的金属化层,适合回流焊装配。
适用于精密测量仪器、传感器前端、电源分压、滤波/阻抗网络、精密放大器的反馈回路以及对稳定性、漂移有严格要求的消费电子与工业控制设备。
采用标准无铅回流焊工艺,建议参考供应商的回流温度曲线与峰值温度限制。贴装时避免过度热应力与机械弯折,存储和焊接环境应避免长期潮湿以防表面污染影响焊接质量。
薄膜工艺本身在长期漂移、噪声和温度稳定性方面表现优良。出货前通常经过阻值、温漂、绝缘与焊接可靠性测试。具体的环境与寿命指标(如耐湿、耐热冲击等)请以厂方完整规格书为准。
在设计时以 100mW 功率和 75V 最大电压为限制,必要时进行功率与电压裕量计算;高温或高功率场合应考虑更大封装或并联使用以分散热量。购置与批量应用前建议索取 UNI-ROYAL 的完整数据手册与可靠性报告以确认所有环境与工艺参数。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products