WMSIC Electronic Components

UNI-ROYAL 0402WGJ047JTCE

Model0402WGJ047JTCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGJ047JTCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGJ047JTCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.009g
Electronic Component
4.7Ω
Electronic Component
10
Electronic Component
BM0258833855
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGJ047JTCE 产品概述

一、概述

0402WGJ047JTCE 为 UNI-ROYAL(厚声)品牌的贴片厚膜固定电阻,阻值 4.7Ω,精度 ±5%(J)。该型号采用 0402 超小封装,额定功率 62.5mW,额定工作电压 50V,适用于空间受限的消费电子、移动终端及高密度电路板的通用阻值需求。

二、主要参数

  • 阻值:4.7Ω
  • 精度:±5%(J)
  • 功率:62.5mW(额定)
  • 工作电压:50V
  • 温度系数:±200ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:0402(约 1.0mm × 0.5mm)
  • 类型:厚膜电阻(贴片)

三、性能特点

  • 体积小、重量轻,利于高密度布板与微型化设计;
  • 厚膜工艺成本经济,适合大批量量产;
  • 温度系数 ±200ppm/℃,在温度波动较小的场合能保证阻值稳定;
  • 宽工作温度范围,适应工业级环境要求。

四、应用场景

  • 移动设备、可穿戴设备的分压、限流、偏置电路;
  • 各类传感器信号调节与阻抗匹配;
  • 通信设备和消费电子的常规电阻配套元件;
  • 需小封装、低功耗的高密度电路板设计。

五、使用与选型建议

  • 额定功率 62.5mW 为 25℃ 下测定值,高温环境或受限散热时需降额使用;具体降额曲线建议参考厂家数据;
  • 工作电压 50V,不可长期超过该值以避免绝缘或击穿问题;
  • ±5% 精度适用于非高精度测量或容差可控的应用,若需更高精度请选用更低温漂或更高精度型号;
  • 温度系数 ±200ppm/℃ 表示阻值随温度变化有一定漂移,温敏电路请谨慎评估。

六、焊接与可靠性

  • 兼容常规回流焊工艺,但应按照厂方推荐的回流温度曲线和制程控制进行;
  • 0402 小封装在手工焊接或返修时需注意热量控制与焊盘保护;
  • 厚膜结构在抗冲击和耐湿性能上表现良好,但不适合承受高浪涌能量和长时间过载。

七、局限与注意事项

  • 低额定功率限制了其在电源、功率耗散较大的场合使用;
  • 对于高频精密匹配或低温漂场合,厚膜 ±200ppm/℃ 的特性可能不满足要求,应考虑薄膜或金属膜器件;
  • 封装尺寸小,焊盘设计与贴装精度需与 PCB 制造/贴片设备相匹配。

八、包装与采购提示

  • 常见为卷带(Reel)包装,便于 SMT 贴片;采购时确认料号 0402WGJ047JTCE 与包装单位(卷数/盘)一致;
  • 建议向供应商索取完整规格书、回流曲线、降额曲线及可靠性测试报告以便设计验证。

如需更详细的电气特性曲线、热阻或封装尺寸图纸,我可协助整理并给出 PCB 焊盘建议和降额计算示例。

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