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UNI-ROYAL 0201WMF2402TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF2402TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF2402TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 24kΩ
- Electronic Component
- 10
- Electronic Component
- BM0257644977
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF2402TEE 产品概述
一、产品简介
0201WMF2402TEE 是 UNI-ROYAL（厚声）推出的一款高密度贴片厚膜电阻，阻值为 24kΩ，精度 ±1%，额定功率 50mW，适用于对体积、稳定性与成本有严格要求的现代电子产品。该器件采用 0201 超小封装，专为高密度组装与微型化电路设计，兼顾控制信号与分压网络等精度需求。
二、主要技术参数
- 电阻类型：厚膜电阻
- 阻值：24kΩ
- 精度：±1%
- 额定功率：50mW
- 最高工作电压：25V
- 温度系数（TCR）：±200 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装尺寸：0201（典型尺寸 0.6 mm × 0.3 mm）
- 品牌：UNI-ROYAL（厚声）
三、产品特点
- 小型化：0201 封装极大节省 PCB 面积，适合高密度贴片与多层板设计。
- 精度可靠：±1% 公差满足精密分压、参考及模拟信号处理电路的精度需求。
- 宽温度范围：-55℃~+155℃，适合工业级与车规级温度环境（具体可靠性请参考完整数据手册）。
- 稳定性与一致性：厚膜工艺在成本与工艺可重复性上具优势，适合中高批量生产。
- 兼容自动化贴装：适配常规 SMT 贴装与回流焊工艺，利于生产效率提升。
四、典型应用
- 移动终端、可穿戴设备、IoT 节点等空间受限的消费电子；
- 精密模拟电路中的分压与阻抗匹配；
- 传感器前端与低功耗信号链路；
- 无线通讯、射频前端的偏置与反馈网络（需注意功率与寄生影响）；
- 工业控制与仪表中对体积与稳定性均有要求的应用场景。
五、焊接与选型注意事项
- 功率与温度：50mW 为器件在规定环境温度下的额定消耗，使用时应考虑温度升高与功率降额（请参照制造商的降额曲线）。
- 电压限制：最高工作电压 25V，超出时可能引起击穿或性能退化。
- 回流焊：支持无铅回流工艺，建议遵循元件及 PCB 材料的回流温度曲线，避免长时间高温暴露。
- 贴装工艺：0201 体积极小，需使用高精度贴片机与合适的吸嘴，焊膏印刷孔径与锡膏量需优化以防偏位或短路。
- 可靠性：对机械应力敏感，板间搬运与振动测试应做好防护设计；在高湿或腐蚀环境中建议采取清洗与涂覆工艺保护。
六、包装与订购信息
- 包装形式：标准 SMT 卷带（tape-and-reel），适配自动贴片生产线。具体卷盘尺寸与每盘数量请咨询供应商或查阅规格书。
- 订单建议：小贴片电阻在设计初期建议预留合理测试点并做可靠性验证；批量采购前可先索取样品与规格书进行评估。
如需完整数据手册、降额曲线或可靠性测试报告，可联系 UNI-ROYAL（厚声）或授权分销商获取详细资料与技术支持。
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