WMSIC Electronic Components

UNI-ROYAL 0201WMF1003TEE

Model0201WMF1003TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF1003TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF1003TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
100kΩ
Electronic Component
50
Electronic Component
BM0257242267
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF1003TEE 产品概述

一、产品简介

0201WMF1003TEE 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,阻值 100 kΩ,精度 ±1%,额定功率 50 mW,工作电压 25 V。超小型 0201 封装适合高密度表面贴装电路,适用于对体积和焊盘空间有严格限制的消费类与工业电子产品。

二、主要技术参数

  • 阻值:100 kΩ(标称)
  • 精度:±1%(F 类)
  • 功率:50 mW(额定)
  • 最大工作电压:25 V
  • 温度系数(TCR):±200 ppm/℃
  • 工作温度范围:-55℃ 至 +155℃
  • 结构类型:厚膜电阻
  • 封装:0201(超小型表贴)

三、性能特点

  • 体积小、占板面积低,便于高密度布板与多层 PCB 设计。
  • ±1% 精度在空间受限的场合可满足多数分压、偏置及滤波网络要求。
  • 厚膜工艺成本低、批量一致性好,适合量产项目。
  • TCR ±200 ppm/℃ 表明温漂中等,适合对温漂要求不是极高的模拟或数字电路。
  • 额定工作温度范围宽,符合工业级环境使用需求。

四、典型应用场景

  • 手机、平板和可穿戴设备中的密集信号路径和偏置网络。
  • IoT 终端、蓝牙模块与无线通信设备的阻抗匹配与分压。
  • 工业控制、仪表与消费电子的小型化电路板。
  • 需要大量相同阻值组件的滤波、拉高/拉低电阻阵列应用。

五、可靠性与环境适应性

该系列电阻经过常规热循环、焊接可靠性与机械应力测试,能适应-55℃ 至 +155℃ 的工作环境。厚膜结构在抗冲击和抗振动性能方面表现良好。建议在关键高精度或低噪声电路中评估是否需改用低 TCR 的薄膜或金属膜电阻。

六、安装与使用注意事项

  • 焊接:遵循制造商推荐的回流焊曲线,避免过长高温暴露;典型回流峰值温度不超过 260℃。
  • 功率与散热:0201 的额定功率仅 50 mW,实际使用时建议留有裕量(常规设计中尽量不超过额定功率的 50%~70%)。
  • 清洗与处理:可使用常规电子清洗剂清洗,避免强溶剂长时间浸泡;贴片取放请使用防静电工具。
  • 存储:建议防潮密封包装,按 JEDEC/制造商要求存储并在必要时回流焊前进行烘烤处理。

七、封装与订购信息

  • 封装形式:0201 贴片卷带包装,适配自动贴片机。
  • 型号示例:0201WMF1003TEE(“1003” 表示 100 kΩ)
  • 订购时请确认批次、包装数量及是否需要阻值筛选或特殊测试报告(如寿命试验或高温老化报告)。

八、选型建议

若电路对温漂或噪声敏感,建议评估薄膜/金属膜替代品或选用更低 TCR、低噪声规格的电阻;若空间受限且需大量配置,0201WMF1003TEE 提供了良好的性价比与产能匹配。选型时请同时考虑功率裕量、焊接工艺与长期可靠性需求。

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