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UNI-ROYAL 0201WMJ0000TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMJ0000TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMJ0000TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 0Ω
- Electronic Component
- 10
- Electronic Component
- BM0257242268
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Resistor Type
- Resistor
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMJ0000TEE 产品概述
一、产品简介
0201WMJ0000TEE 是 UNI-ROYAL（厚声）推出的一款 0201 封装厚膜 0Ω 贴片电阻。该器件以厚膜工艺制成，标称阻值 0Ω，公差 ±5%，额定功率 50mW，最大工作电压 25V，工作温度范围 -55℃ 至 +155℃。微小的 0201 封装使其非常适合高密度贴片线路板上的跳线、可配置网络和制造流程替代元件。
二、主要特性
- 阻值：0Ω（跳线/短路用元件）
- 精度：±5%
- 功率：50mW（在标准环境下的额定功耗）
- 直流工作电压：25V
- 工作温度：-55℃ ~ +155℃
- 封装：0201（0603M 约为 0.6mm × 0.3mm 级别尺寸）
- 制造工艺：厚膜（可靠性好，成本优势明显）
- 品牌：UNI-ROYAL（厚声）
三、典型应用场景
0201WMJ0000TEE 适用于需要占位或可配置走线的小型化电子产品，包括但不限于：
- 手机、可穿戴设备、平板电脑等消费类移动终端的信号/地线跳线；
- 高密度通信模块的电路配置与阻断/连接替换；
- 测试点短接、生产调试桥接件以及替代传统线跳线的应用；
- 航空航天、汽车电子等需高温工作环境下的低阻连接（需与系统设计一同评估）。
四、使用与设计注意事项
- 由于为 0Ω 元件，其实际等效电阻很低，但在高电流场合，应以焊盘、PCB 走线及焊料承载能力作为限制依据，不建议将其作为高电流主流路径的长期导体。
- 在布线时预留适当的焊盘尺寸和过孔方案，确保在回流焊后焊点可靠。0201 尺寸极小，贴装和锡膏印刷精度要求高。
- 推荐遵循通用无铅回流温度曲线进行焊接，避免过高温度或长时间停留造成封装应力或性能退化。
- 在高温环境下（接近上限 +155℃）使用时，应结合系统热设计评估长期可靠性。
五、可靠性与品质
厚声（UNI-ROYAL）作为专业元件供应商，产品通过严格的制造与检验流程。0201WMJ0000TEE 在标准温湿循环、机械冲击与振动测试条件下表现稳定，适合量产和严格品质要求的应用。具体可靠性数据（如焊接可焊性、热循环次数、寿命测试）可在技术文档或样品测试中获取。
六、封装与订购建议
- 封装形式为 0201 贴片，便于自动化贴装。
- 常用供应形式为卷带（Tape & Reel），便于 SMT 贴片机取料与批量生产。
- 选型时请确认封装尺寸、回流焊工艺兼容性以及电路板设计是否满足 0201 的装配精度要求。需要样品或批量采购信息，请联系供应商获取完整物料号、规格书与可用性。
结语：0201WMJ0000TEE 凭借微小封装与可靠的厚膜制造工艺，是现代高密度电路中常用的零阻跳线选择。在设计与装配阶段注意热管理与焊接工艺，可发挥其在尺寸受限与配置灵活性方面的优势。
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