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UNI-ROYAL 0201WMF1002TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF1002TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF1002TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 10kΩ
- Electronic Component
- 10
- Electronic Component
- BM0257242266
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF1002TEE 产品概述
一、产品简介
0201WMF1002TEE 是 UNI-ROYAL（厚声）推出的一款超小型贴片厚膜电阻，阻值 10kΩ，精度 ±1%，额定功率 50mW，额定工作电压 25V。封装为 0201（公制约 0.6 mm × 0.3 mm），工作温度范围 -55℃ 至 +155℃，温度系数为 ±200 ppm/℃。该器件以体积极小、性能稳定、适用于高密度布板与超小型电子产品为主要特点。
二、主要性能与特点
- 超小封装：0201 尺寸有利于高密度组装与减小 PCB 面积，适合便携与微型化设计。
- 稳定阻值：10kΩ ±1% 的阻值精度满足大多数滤波、分压、偏置和阻抗匹配电路需求。
- 温度特性：±200 ppm/℃ 的温度系数在一般工业与消费类应用中表现良好，温度范围覆盖 -55℃ 至 +155℃，可靠性高。
- 功率与电压：50mW 的额定功率及 25V 的工作电压适配低功耗、低电压的移动与物联网终端应用。
- 制程与材料：采用厚膜工艺，焊接性好，价格与批量可控，适合大规模制造。
三、典型应用场景
- 移动终端与可穿戴设备：用于电源分配、传感器接口和阻抗匹配，节省空间并降低重量。
- 物联网与低功耗终端：在传感器前端、信号采集与滤波电路中广泛使用。
- 高密度 PCB 与多层板：适合微小化布局和高元器件密度设计，减少 PCB 面积成本。
- 工业与汽车电子（非关键功率位）：在耐温与可靠性要求中，作为通用偏置与分压元件使用。
四、设计与装配建议
- 焊接兼容性：推荐与常规无铅回流工艺兼容，建议在制程中参考制造商提供的回流曲线以确保焊点质量。
- 布局注意：0201 元件尺寸极小，布局时应提高焊盘精度与丝印清晰度，便于贴装与检修。
- 功率与热管理：实际环境中应考虑周围元件的热耦合及 PCB 散热条件，避免长期在额定功率附近工作以延长寿命。
- 储存与搬运：避免在潮湿或有机污染环境中长时间存放，贴片元件应按制造商建议进行干燥与防潮处理。
五、可靠性与测试
0201WMF1002TEE 满足常规厚膜电阻的可靠性要求，在温度循环、湿热和焊接冲击等可靠性试验中表现良好。其 ±200 ppm/℃ 的 TCR 与 -55℃ 至 +155℃ 的宽温范围，使其在多种环境下保持阻值稳定。建议在关键应用中进行样机验证与环境应力筛选（ESS）以确保长期性能。
六、小结
0201WMF1002TEE 以其微小体积、±1% 精度与良好温度特性，适合要求尺寸受限且需稳定阻值的现代电子产品。对于追求高密度封装与成本可控的量产项目，该型号提供了平衡的性能与可制造性，是移动、物联网和消费电子等领域的理想选择。若需更详细的封装尺寸图、回流曲线或可靠性数据，可联系供应商获取完整数据手册。
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