WMSIC Electronic Components

UNI-ROYAL 0402WGF8452TCE

Model0402WGF8452TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF8452TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF8452TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
84.5kΩ
Electronic Component
10
Electronic Component
BM0257244984
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF8452TCE 产品概述

一、产品简介

0402WGF8452TCE 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,标称阻值 84.5 kΩ,精度 ±1%,额定功率 62.5 mW(0402 尺寸),工作电压额定 50 V,温度系数(TCR)±100 ppm/°C,工作温度范围 -55℃ ~ +155℃。该器件采用常见的 0402(公制 1005)微型封装,面向高密度贴片电路与精度要求较高的通用电阻场合。

二、主要电气参数

  • 标称阻值:84.5 kΩ
  • 精度等级:±1%
  • 额定功率:62.5 mW(环境/封装限定)
  • 额定工作电压:50 V
  • 温度系数:±100 ppm/°C(典型厚膜等级)
  • 工作温度:-55℃ ~ +155℃

说明与计算示例:

  • 理论上由功率与阻值决定的最大允许电压 Vmax = √(P·R) ≈ √(0.0625×84500) ≈ 72.7 V,但器件额定工作电压受封装和设计限制标为 50 V,请以 50 V 为限。
  • 在 50 V 下通过电流约为 I = 50 / 84500 ≈ 0.592 mA,功耗约 29.6 mW(低于额定功率,处于安全范围)。

三、关键特性与优点

  • 小封装高密度:0402 尺寸适用于空间受限、高密度布板设计。
  • 精度较高:±1% 精度便于用作分压、反馈与基准电阻等对精度有要求的电路。
  • 宽工作温度:-55℃~+155℃,适合集成到工业级和复杂环境应用中。
  • 稳定性与温漂:TCR 为 ±100 ppm/°C,温度变化 100℃ 时阻值变化约 1%,对多数通用电路保持良好稳定性。
  • 品牌与制造工艺:UNI-ROYAL(厚声)厚膜工艺,适用于成本与可靠性兼顾的批量生产。

四、使用与设计注意事项

  • 功率与热管理:标称功率 62.5 mW 在实际 PCB 上可能受铜箔面积、散热条件影响,建议在高密度或高温环境下做适当去率(derating),以延长可靠性。
  • 电压限制:尽管理论 Vmax 较高,但请严格遵守额定工作电压 50 V,避免介电击穿或长期偏置引起失效。
  • 温漂叠加:系统设计时需考虑 TCR 与初始公差叠加效应,尤其在温度范围变化大的应用中,可能影响精度要求严格的测量电路。
  • 贴装与焊接:适用于常规回流焊工艺。建议遵循厂商及行业(如 IPC/JEDEC)回流温度曲线,避免过高峰值温度或过长高温保持时间。
  • 机械与储存:0402 为超小封装,搬运与贴装时避免机械冲击或翘折。储存时建议防潮、防尘并保持卷带封条完整。

五、典型应用

  • 精密分压器与基准电路(要求 ±1% 精度)
  • 信号调理、滤波器网络与增益设定电阻
  • 消费电子、移动设备、可穿戴与小型化模块中的通用电阻元件
  • 工业控制与传感器接口(得益于宽温度范围)
  • 混合信号 PCB 中需要占位小的阻值元件

六、封装与供货

该系列常见以卷带(Tape & Reel)形式供货,适合贴片机自动化贴装;也可按需求提供散装或切带。0402 尺寸利于高密度自动化生产,建议在领取时确认包装端面、抗潮等级及批次记号以便可追溯性管理。

七、型号说明(推测)

  • “0402”:封装尺寸(0402/1005)
  • “WGF”:系列或制造工艺标识(厚膜)
  • “8452”:与 84.5 kΩ 阻值相关的编码
  • “TCE”:可能与包装、温度或特殊工艺相关

以上为基于给定参数的产品概述与使用建议。若需更详细的可靠性数据(如寿命试验、老化曲线、潮气敏感等级、焊接曲线)或样品与报价,请提供具体采购数量或联系供应商索取完整规格书。

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