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0402WGF2211TCE是厚声电子(UNI-ROYAL) 推出的一款0402封装贴片厚膜电阻,属于通用型高可靠性器件。型号中:
该产品采用厚膜工艺制造,兼顾小体积、高精度与环境适应性,广泛应用于消费电子、工业控制等领域。
±1%的精度可满足信号放大、滤波电路的阻值匹配需求;±100ppm/℃的TCR保证了宽温环境下阻值稳定,尤其适合对信号一致性要求较高的场景(如传感器信号采集)。
0402封装尺寸紧凑(1.0mm×0.5mm),但额定功率达62.5mW,比同封装普通电阻的功率密度提升约20%,可有效节省PCB空间,适配智能手机、智能穿戴等高密度集成设备。
-55℃~+155℃的工作温度范围,能应对低温(北方户外设备)、高温(车载发动机舱附近)等极端环境,无需额外散热设计,降低电路复杂度。
厚膜电阻的膜层与陶瓷基底结合牢固,抗机械冲击、耐老化性能优于薄膜电阻(部分场景),长期使用(>1000小时)阻值变化率<0.5%,适合工业设备的长期运行需求。
50V额定工作电压覆盖了多数低压电路(3.3V、5V、12V系统),无需担心电压击穿风险,适用范围广。
该电阻的性能适配多领域设计需求,常见应用包括:
作为国内电阻制造龙头企业,厚声电子拥有20余年厚膜电阻生产经验,产品通过ISO9001、IATF16949等国际认证,供货稳定,品质符合汽车电子、工业级标准。
0402封装是电子设备中应用最广泛的小封装之一,贴装效率高(高速贴片机每小时可贴装数万件),且与Altium、Cadence等主流PCB设计软件兼容,降低设计与生产难度。
0402WGF2211TCE贴片厚膜电阻凭借高精度、小体积、宽温适应性与可靠性能,成为消费电子、工业控制、汽车电子等领域的优选器件,适配多种电路设计需求,是平衡性能与成本的理想选择。
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WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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