WMSIC Electronic Components

UNI-ROYAL 0201WMF2002TEE

Model0201WMF2002TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF2002TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF2002TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
20kΩ
Electronic Component
10
Electronic Component
BM0257242271
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF2002TEE 产品概述

一、产品简介

0201WMF2002TEE 为 UNI-ROYAL(厚声)系列超小型贴片厚膜电阻,封装规格为 0201,阻值 20kΩ,精度 ±1%,额定功率 50mW,额定工作电压 25V。该型号以体积极小、适合高密度组装为特点,面向移动终端、可穿戴设备和高密度 PCB 的精密分压、偏置与滤波应用。

二、主要电气性能

  • 阻值:20 kΩ ±1%(精密配比适合精确偏置与电阻网络)
  • 额定功率:50 mW(常温条件下)
  • 最大工作电压:25 V(在任何情况下不得超过)
  • 温度系数(TCR):±200 ppm/℃(中等温漂,适合一般工业与消费类温度稳定性要求)
  • 工作温度范围:-55 ℃ ~ +155 ℃(满足工业级温度耐受性)

三、结构与封装优势

0201 超小型封装便于实现极高的线路密度与组件缩小,有利于轻薄短小终端产品设计。厚膜工艺保证良好的批量一致性与成本效益,适合大批量制造且工艺可控。

四、典型应用场景

  • 移动通信、蓝牙与可穿戴设备的分压、反馈与偏置网络
  • 高密度主板与模块化仪器的去耦与滤波电路
  • 传感器接口与模拟信号处理中的精密电阻阵列
  • 工业控制与汽车电子(在满足额定功率与电压限制下)

五、可靠性与使用建议

  • 建议采用标准回流焊工艺,峰值回流温度与曲线按 SMT 工艺规范执行以避免热应力损伤。
  • 由于单颗额定功率仅 50 mW,建议在实际工作温度下进行功率降额设计,高温环境应适当降低允许功率。
  • 最大工作电压 25 V,应在电路设计中避免超过该值以防击穿或长期老化。
  • 存储与搬运按常规贴片元件要求,避免潮湿与机械冲击。

六、封装与订购注意

产品以卷带或盘装形式供货,适配自动贴装生产线。订购时请注明产品型号 0201WMF2002TEE、阻值与包装方式,必要时索取厂家可靠性试验报告与回流曲线以确认工艺兼容性。

七、小结

0201WMF2002TEE 结合了 UNI-ROYAL 的成熟厚膜工艺与 0201 超小型封装特点,适合对体积和装配密度要求较高且对阻值精度有较高要求的电子产品。设计时关注功率与最大电压限制,并按厂商建议的贴装与回流规范执行,可获得稳定可靠的电路性能。

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