WMSIC Electronic Components

UNI-ROYAL 0402WGF7322TCE

Model0402WGF7322TCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF7322TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF7322TCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
73.2kΩ
Electronic Component
10
Electronic Component
BM0257244939
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF7322TCE 产品概述

一、基本参数与型号说明

0402WGF7322TCE 为 UNI-ROYAL(厚声)系列贴片厚膜电阻,封装尺寸为 0402(约 1.0 mm × 0.5 mm)。主要电气参数如下:

  • 阻值:73.2 kΩ
  • 精度:±1%
  • 额定功率:62.5 mW
  • 工作电压:50 V
  • 温度系数(TCR):±100 ppm/℃
  • 工作温度范围:-55 ℃ 至 +155 ℃
    该型号适合对体积、稳定性和中高阻值有要求的表面贴装电路。

二、主要特性与优势

  • 小型化:0402 尺寸便于高密度布局,适合便携与消费电子产品。
  • 良好精度与温漂:±1% 精度配合 ±100 ppm/℃ 的 TCR,可满足一般精密分压、偏置与滤波网络的稳定性需求。
  • 宽温度范围:-55℃~+155℃,适应工业级及苛刻环境下的工作。
  • 合理功率能力:62.5 mW 适合低功耗电路中的偏置与测量电阻使用。

三、典型应用场景

  • 电阻分压器与基准偏置网络(高阻值场合)
  • 传感器前端、信号调理电路中的阻值设定
  • 移动设备、物联网终端、消费电子的空间受限电路
  • 精密滤波、时钟电路与模拟电路中需稳定阻值的场合

四、可靠性与使用建议

  • 建议在长期运行时对功率进行去级(例如将实际耗散控制在额定功率的 50% 左右),以延长寿命并降低热漂移风险。
  • 在高湿、高温或振动环境下,应结合系统散热与封装布局进行热管理。
  • 推荐在设计时预留阻值容差和温漂余量,关键应用可配套温度补偿或校准电路。

五、封装与焊接注意事项

  • 0402 尺寸对贴装与回流工艺敏感,建议使用兼容的 SMT 贴片工艺与无铅回流曲线,峰值温度按厂家工艺规范执行。
  • 过度机械应力或不当回流可能引起端接开裂或电阻漂移,焊盘设计应避免过大热沉差以保证焊接可靠性。
  • 推荐在 PCB 设计中参考制造商的推荐焊盘尺寸与阻焊规则。

六、选型要点与替代

  • 若需更低温漂或更高功率,应考虑薄膜或金属膜电阻以及更大封装(0603、0805)型号。
  • 对于更高工作电压或更严格可靠性要求,可优先选择额定电压与功率更高的产品线或通过并联/分流设计实现。

总之,0402WGF7322TCE 以其小型化、良好精度与宽温范围,适合空间受限且要求稳定性的中高阻值应用,在实际设计中注意功率去级与合理的焊接工艺即可获得稳定可靠的性能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.