Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 1206W4F120LT5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 1206W4F120LT5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 1206W4F120LT5E
- Electronic Component
- 1
- Package
- 1206
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.03g
- Electronic Component
- 120mΩ
- Electronic Component
- 1
- Electronic Component
- BM0257624979
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 200V
- Electronic Component
- ±800ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206W4F120LT5E 产品概述
一、产品简介
1206W4F120LT5E 为 UNI-ROYAL（厚声）系列的一款贴片厚膜低阻值电阻，封装为 1206，标称阻值 0.12Ω（120mΩ），精度 ±1%，额定功率 1/4W（250mW），额定工作电压 200V，温度系数（TCR）为 ±800ppm/℃，工作温度范围 -55℃ 至 +155℃。该器件针对需要低阻抗电流取样或旁路测量、但对成本和体积有严格限制的场合设计。
二、主要电气参数与计算参考
- 阻值：0.12Ω ±1%
- 额定功率：250mW（在推荐的散热条件下）
- 最大连续电流（理论值，基于额定功率）：I = sqrt(P/R) ≈ sqrt(0.25/0.12) ≈ 1.44 A
- 在该电流下电压降：V = I·R ≈ 0.173 V
- TCR：±800 ppm/℃，例如温升或环境温度与基准温度相差 50℃ 时，阻值可变化约 4%（约 0.12Ω±0.0048Ω）
上述数值为理论与典型计算值，实际应用中需考虑 PCB 散热、环境温度及脉冲热效应对允许电流的影响，应做必要的裕量设计和实验验证。
三、主要特性与优势
- 低阻值，适合电流取样、检测电流通路的电流测量与限流应用；
- 1206 常用封装，方便自动贴装和批量生产；
- ±1% 精度在许多电流检测场合已能满足测量要求；
- 工作温度范围宽，适用于工业级环境；
- 价格与工艺上相对经济，适合对精度要求不是极端苛刻的成本敏感型方案。
四、典型应用场景
- 电源管理：电池管理系统（BMS）、DC-DC 转换器电流检测；
- 电机驱动与负载监测的低侧或高侧取样（需配合合适的放大器与布线）；
- 过流保护与限流电路；
- 工业与消费电子中要求低压降的电流检测场合。
五、选型与使用建议
- 温度影响：TCR 较大，温度变化会引起显著阻值漂移；对测量精度要求高的场合建议采用四端（Kelvin）取样电阻或配合温度补偿与校准；
- 功率与散热：1206 封装热阻较大，请根据 PCB 走铜面积和层数设计散热通道，必要时增大焊盘铜厚度或加铜箔散热；建议在连续工作时取保守电流（如 ≤1.2 A）并做热验证；
- 焊接工艺：兼容常见回流焊工艺，遵循厂家推荐的回流温度曲线，避免过长时间高温或机械应力造成的可靠性问题；
- 布局提示：为获得稳定的测量和最低接触误差，走线应尽量粗短，避免在电阻引脚附近引入额外串联阻抗；对精密测量建议设计差分放大器并把电阻布置为四端测量（如条件允许更换为专用分流电阻）。
如需进一步的可靠性数据（如寿命试验、脉冲功率等级或典型 PCB 散热数据）、器件封装图或推荐焊盘尺寸，可提供具体资料以便给出更精准的设计建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
