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UNI-ROYAL 0805W8F3902T5E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0805W8F3902T5E
- Type
- UNI-ROYAL
- Minimum package
- 5000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0805W8F3902T5E
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.027g
- Electronic Component
- 39kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257245699
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 150V
- Electronic Component
- ±100ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805W8F3902T5E 产品概述
一、产品简介
0805W8F3902T5E 为 UNI-ROYAL（厚声）系列厚膜贴片电阻，封装规格为 0805（公制 2012）。标称阻值 39 kΩ，精度 ±1%（E96），额定功率 125 mW，额定工作电压 150 V，温度系数（TCR）±100 ppm/℃，适用温度范围 -55℃ 至 +155℃。该型号面向对尺寸、稳定性与成本有综合要求的一般电子应用场景。
二、主要电气参数
- 阻值：39 kΩ，精度 ±1%（符合紧密公差的精密匹配需求）；
- 功率：125 mW（常温额定）；
- 最大工作电压：150 V（直流或直流等效）；
- 温度系数：±100 ppm/℃，在温度变化时保持较好阻值稳定性；
- 工作温度范围：-55℃～+155℃，适应宽温区工业与车载类环境。
三、结构与封装信息
0805（2012）封装体积小、占板面积低，适合高密度贴片布线。厚膜工艺制造，具有良好的耐焊性与成本优势，适用于自动贴装与回流焊工艺。该类电阻常见终端处理便于焊接与可靠接触。
四、性能与可靠性说明
- 宽温工作能力：-55℃ 至 +155℃ 的额定温度范围保证在工业级与部分恶劣环境下长期可靠；
- 热稳定性：TCR ±100 ppm/℃ 可满足多数模拟与数字电路对温漂的中等要求；
- 功率降额：在高温环境下需按厂商降额曲线处理，常见做法为自 70℃ 起线性降额至最高环境温度；
- 耐久与机械可靠性：厚膜电阻对震动、热循环和焊接热冲击具有良好耐受性（建议参考厂商可靠性试验报告以满足特定认证要求）。
五、应用场景
- 消费电子、移动设备与便携式仪器的分压、偏置和限流；
- 仪表、测量电路与传感器前端的阻值网络；
- 工业控制、通信设备与车载电子（需按整机认证要求验证）中常规精度阻值需求的应用；
- PCB 高密度布线场合，兼顾体积与性能的通用替代件。
六、建议使用与采购注意事项
- 贴装与焊接：适用于常规回流焊流程，但建议遵循厂商推荐的回流曲线与预热/冷却要求；
- 储存与搬运：避免受潮与机械冲击，贴片卷盘存放并在规定周期内使用；
- 选型注意：在高精度或低温漂场合，考虑更低 TCR 或金属膜/薄膜替代件；在高电压或高功耗条件下，确认实际电压与功耗是否超出器件额定值并采用降额设计；
- 订购信息：产品型号 0805W8F3902T5E 对应 0805 封装、39kΩ、±1% 厚膜 SMD 电阻。采购时请向供应商确认包装形式、批次和可靠性测试报告。
以上为该型号的核心参数与应用要点，可作为选型与设计参考。如需更详细的电气老化曲线、阻值温漂曲线或焊接工艺参数，可提供后续从厂商数据表获取的完整资料。
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