WMSIC Electronic Components

UNI-ROYAL 0201WMF2800TEE

Model0201WMF2800TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF2800TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF2800TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
280Ω
Electronic Component
50
Electronic Component
BM0259480122
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF2800TEE 产品概述

一、产品简介

0201WMF2800TEE 为 UNI-ROYAL(厚声)出品的贴片厚膜电阻,阻值 280Ω,精度 ±1%,额定功率 50mW,额定工作电压 25V。封装为极小型 0201(约 0.6mm × 0.3mm),适用于高密度表贴电路板与空间受限的电子产品。

二、主要技术参数

  • 电阻类型:厚膜电阻(贴片)
  • 阻值:280Ω
  • 精度:±1%(1Ω 级)
  • 额定功率:50mW
  • 额定工作电压:25V
  • 温度系数(TCR):±200 ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 封装:0201(超小型)
  • 品牌:UNI-ROYAL(厚声)

三、产品特点

  • 小体积、高集成度:0201 尺寸极小,便于实现高密度布板与微型化设计;
  • 稳定性好:厚膜材料配方与工艺保证在常见温湿度与振动条件下的电阻稳定性;
  • 宽温区适应性:工作温度覆盖 -55℃ 至 +155℃,适合工业级应用;
  • 可回流焊兼容:适配常见无铅回流工艺,适合自动贴装生产线。

四、典型应用

  • 手机、可穿戴设备与消费类微型化电子产品;
  • 高频通信终端与射频前端的外围电路(限于功率/电压规格范围内);
  • 精密仪表、传感器接口及医疗便携设备的分流、限流与阻抗配合;
  • 对空间和重量有严格要求的航空电子与物联网终端。

五、封装与交付

  • 0201 托盘或卷带包装,适配高速贴片机取料;
  • 出厂静电防护与湿敏等级按行业规范处理,便于长期储存与运输。

六、使用与注意事项

  • 0201 尺寸极小,取放与焊接需使用精密贴装设备;
  • 焊接建议采用规范的无铅回流曲线,避免过热或超时焊接;
  • 在设计时注意功率和工作电压限制,温度上升会影响额定功率;
  • 建议在关键应用中进行样品测试验证温漂、负载寿命与焊接可靠性。

如需完整的电阻参数表、回流焊推荐曲线或样品评估报告,可联系供应商获取详尽数据与可靠性测试结果。

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