WMSIC Electronic Components

UNI-ROYAL 0201WMJ0151TEE

Model0201WMJ0151TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMJ0151TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMJ0151TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.008g
Electronic Component
150Ω
Electronic Component
50
Electronic Component
BM0265114270
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMJ0151TEE 贴片厚膜电阻产品概述

一、产品核心身份与定位

0201WMJ0151TEE是厚声电子(UNI-ROYAL) 推出的一款0201封装贴片厚膜电阻,属于常规精度小功率电阻范畴。该型号以“150Ω阻值+±5%精度+50mW功率”为核心参数,适配高密度电路设计对小型化、低功耗、宽温稳定的需求,广泛应用于便携电子、工业控制、小型传感器等领域。

二、基础电气与物理参数解析

该电阻的核心参数围绕“小型化+平衡性能”设计,具体解析如下:

2.1 阻值与精度

  • 标称阻值:150Ω(型号中“151”为阻值代码,即15×10¹=150Ω);
  • 精度等级:±5%(工业级常规精度,兼顾成本与性能,满足非超高精密电路需求)。

2.2 功率与电压能力

  • 额定功率:50mW(即1/20W,1W=1000mW,换算后符合小功率设计要求);
  • 最大工作电压:25V(避免过压击穿风险,适配多数低压电路的电源与信号电平)。

2.3 温度特性

  • 温度系数(TCR):±200ppm/℃(每变化1℃,阻值变化±200×10⁻⁶×150=±0.03Ω);
  • 工作温度范围:-55℃~+155℃(覆盖工业级宽温环境,满足极端温度下的可靠性)。

2.4 封装与类型

  • 封装形式:0201(英制尺寸,约0.6mm×0.3mm,为目前主流小型化封装之一);
  • 电阻类型:厚膜电阻(采用丝网印刷+高温烧结工艺,耐环境性优于薄膜电阻,成本低于精密薄膜电阻)。

三、关键性能特性说明

该电阻的性能突出“小型化适配+宽温稳定+批量可靠性”,具体表现为:

3.1 小型化封装的高密度适配

0201封装体积仅为常规0402封装的1/4左右,可大幅节省PCB空间,适配智能手机、智能手表等便携设备的紧凑布局;同时兼容主流SMT贴装设备(贴装精度≥±0.05mm即可满足)。

3.2 宽温范围内的阻值稳定性

±200ppm/℃的温度系数结合-55~155℃的工作范围,极端温度下(如汽车发动机舱、工业户外监测终端),阻值总变化量约为±0.03Ω×210℃=±6.3Ω,仍在±5%精度(±7.5Ω)范围内,确保电路性能稳定。

3.3 厚膜工艺的可靠性优势

厚膜电阻采用陶瓷基底+厚膜电阻浆料烧结而成,抗冲击、抗振动性能优于薄膜电阻,且耐潮湿、耐化学腐蚀能力强;厚声电子该系列电阻批量一致性良率达99.5%以上,适合大规模生产。

3.4 低功耗设计适配

50mW额定功率满足多数低压低功耗电路需求(如蓝牙模块信号衰减、传感器偏置电路),常规电路中降额至80%使用(40mW),余量充足,无需额外设计。

四、典型应用场景

结合参数特性,0201WMJ0151TEE的典型应用场景如下:

4.1 便携电子设备

  • 智能手机/智能手表:音频信号分压电路、心率传感器偏置电阻、电池管理系统电流检测辅助电阻;
  • 蓝牙耳机/智能音箱:电源滤波限流电阻、信号放大反馈电阻。

4.2 工业控制与监测

  • 低功耗PLC:模拟量输入通道分压电阻、数字量输出限流电阻;
  • 户外监测终端:温度传感器信号调理电阻、无线传输模块信号衰减电阻。

4.3 小型传感器模块

  • 压力/加速度传感器:信号放大偏置电阻、零点校准电阻;
  • 气体传感器:加热电路限流电阻(低功耗设计适配)。

4.4 汽车电子(辅助功能)

  • 车载USB充电模块:过流保护采样电阻(非关键安全件,适配宽温环境);
  • 车内氛围灯控制:信号分压电阻(满足-40~85℃车载环境)。

五、品牌与市场优势

作为厚声电子的主流贴片电阻型号,0201WMJ0151TEE具备以下优势:

  1. 品牌可靠性:通过ISO9001、TS16949认证,批量供应能力稳定;
  2. 性价比优势:厚膜工艺降低成本,相比同参数薄膜电阻价格低30%左右,适合中低端批量应用;
  3. 供应链适配:封装符合IPC-7351标准,可与主流电子元器件配套兼容,简化采购流程。

六、使用注意事项

  1. 贴装温度:回流焊峰值温度≤245℃(符合厚膜电阻焊接工艺要求);
  2. 降额使用:温度超过125℃时,功率需降额至额定值的50%以下;
  3. 静电防护:0201封装电阻静电敏感,需采用防静电包装与操作。

该型号以平衡的性能与成本,成为高密度电路设计中常规电阻的优选方案之一。

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