WMSIC Electronic Components

UNI-ROYAL 0603WAF2203T5E

Model0603WAF2203T5E
Package0603
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0603WAF2203T5E
Type
UNI-ROYAL
Minimum package
5000 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0603WAF2203T5E
Electronic Component
1
Package
0603
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.023g
Electronic Component
220kΩ
Electronic Component
10
Electronic Component
BM0257245283
Operating Temperature
55℃~+155℃
Operating Voltage
75V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603WAF2203T5E 产品概述

一、产品简介

0603WAF2203T5E 为 UNI-ROYAL(厚声)系列厚膜贴片电阻,封装尺寸 0603(1608公制),标称阻值 220kΩ,精度 ±1%,额定功率 100 mW,额定工作电压 75 V,温度系数(TCR)±100 ppm/℃,工作温度范围 -55℃ 至 +155℃。适用于要求小型化、高阻值和中等精度的电子电路。

二、主要电气参数与注意事项

  • 阻值:220 kΩ(4 位编码“2203”表示 220 × 10^3 Ω)
  • 精度:±1%
  • 额定功率:100 mW(理论上由功耗决定的电流上限 I = √(P/R) ≈ 0.675 mA)
  • 额定工作电压:75 V(电压极限在高阻值器件常会限制实际可用功率;在 75 V 条件下允许功率约为 75^2 / 220k ≈ 25.6 mW,对应电流约 0.341 mA)
  • 温度系数:±100 ppm/℃,适合一般精度电路但非高精度温漂应用
  • 工作温度:-55℃ ~ +155℃,适应宽温应用场景

提示:在高阻值器件中应优先遵循额定工作电压限制以避免绝缘击穿或电气击穿引起的失效;连续工作时建议对额定功率进行降额(例如 50% 或按照应用环境降额)。

三、特性与应用场景

  • 小体积、适合高密度贴装的表面贴装电阻,适用于消费类电子、通信设备、测量与控制电路、分压/上拉/下拉网络和高阻抗信号路径等。
  • 厚膜工艺成本效益高、批次一致性好,适合量产使用。

四、封装与装配建议

  • 封装:0603(1608),适配常规 0603 贴片工艺与焊盘设计。
  • 焊接:建议按厂家或 JEDEC 推荐的回流焊工艺执行,控制峰值温度与在焊膏液相(liquidus)时长,避免超温或机械应力。
  • 焊盘布局:遵循厂商推荐 land pattern,保证良好焊接强度与热散逸;避免在元件两端施加过大弯曲应力。
  • 清洗与环保:普通溶剂或水洗工艺通常可用,特殊清洗需参考厂商说明。

五、可靠性与选型建议

  • 在高湿、高温或强振环境应进行适当验证试验;如用于高精度温度敏感电路,建议选用更低 TCR 的精密电阻。
  • 选型时注意到额定电压与阻值共同决定最大允许功耗,高阻值器件在高电压下的实际功耗往往受电压限制,应按实际工作电压计算安全余量。

如需更详细的回流曲线、焊盘尺寸、样品测试或料号拆解(T5E 为厂商包装/版本编码),可提供具体应用环境与装配要求,我可进一步给出匹配建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.