Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF7152TEE是UNI-ROYAL(厚声) 推出的0201封装厚膜贴片电阻,属于小型化、高精度、低功率型器件,核心定位是兼顾「空间紧凑性」「信号精度」与「成本控制」,适用于消费电子、工业控制等多领域的常规及恶劣环境电路设计。
该电阻的关键参数支撑其在特定场景下的稳定工作,具体如下:
小型化封装适配高密度设计
0201封装体积仅为常规0402封装的1/4左右,适合智能手机、智能穿戴等对空间要求严苛的便携式设备,可提升PCB集成度,减少电路体积。
厚膜工艺平衡性能与成本
采用厚膜印刷工艺制造,相比薄膜电阻成本更低,同时具备较好的稳定性与耐温性,满足批量应用需求(如消费电子批量生产)。
高精度满足信号处理需求
±1%的精度可替代部分薄膜电阻用于信号分压、电流采样等场景,无需过度追求高精度(如±0.1%)带来的成本增加,性价比突出。
宽温范围适应恶劣环境
-55℃~+155℃的工作温度覆盖工业现场低温(如北方户外设备)、高温环境(如烤箱周边电路),以及汽车电子的部分高温区域(如发动机舱周边)。
低功率电压匹配小信号电路
50mW功率与25V电压的组合,完美适配传感器接口、射频前端辅助电路等小信号模块,避免功率冗余导致的电路损耗。
0201WMF7152TEE因体积小、精度适中、温区宽,广泛应用于以下领域:
该电阻采用厚膜工艺,具备较好的可靠性:
0201WMF7152TEE是一款高性价比的小型化厚膜贴片电阻,兼顾精度、体积与成本,适合多领域的小信号电路设计,是电子工程师优化电路布局与性能的可靠选择。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products