WMSIC Electronic Components

UNI-ROYAL 0201WMF3652TEE

Model0201WMF3652TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF3652TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF3652TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
36.5kΩ
Electronic Component
10
Electronic Component
BM0265088722
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF3652TEE 产品概述

一、产品简介

0201WMF3652TEE 是 UNI-ROYAL(厚声)推出的一款高可靠性贴片厚膜电阻,阻值 36.5kΩ,精度 ±1%,封装规格为 0201。额定功率 50mW,最大工作电压 25V,适用于对体积、精度与温漂有严格要求的超小型电子设备与高密度 PCB 设计。

二、主要参数

  • 阻值:36.5kΩ
  • 精度:±1%(F)
  • 功率:50mW(室温,单元面积限制)
  • 最大工作电压:25V
  • 温度系数(TCR):±200ppm/℃
  • 工作温度范围:-55℃ ~ +155℃
  • 材料与工艺:厚膜(薄膜类比成本更优)
  • 封装:0201(毫米级超小型)

三、性能特点

  • 小体积高密度:0201 尺寸实现更大器件集成密度,节省 PCB 面积。
  • 精度与稳定性:±1% 精度配合 ±200ppm/℃ 的温漂,能在宽温区间保持较好阻值稳定性,适合一般精密分压与信号偏置场合。
  • 低功耗场景优化:50mW 额定功率适用于传感器前端、可穿戴设备及移动终端等低功耗应用。
  • 宽温度范围:-55℃ 至 +155℃,适应汽车电子及工业级环境需求(需注意实际环境下的热管理)。

四、典型应用

  • 移动设备与可穿戴电子(空间受限、低功耗电路)
  • 传感器接口与信号调理电路(分压、偏置、限流)
  • 高密度电路板与模块化组件(例如 Wi-Fi、蓝牙、射频前端的非关键精密位置)
  • 工业与汽车电子中的低功耗电阻网络(注意电压与环境应力)

五、封装与焊接建议

  • 推荐回流焊工艺控制温度曲线以保护微型封装;避免过高峰温和长时间热暴露。
  • 对于 0201 尺寸,建议使用高精度贴装设备与良好焊膏印刷控制,减少偏位和桥连风险。
  • 建议在布局时留出足够的焊盘尺寸与热散路径,尽量避免电阻直接承受热源。

六、可靠性与质量保证

UNI-ROYAL 采用严格的制造与筛选流程,满足常见工业与车规级可靠性试验(详见具体数据表)。在高湿、高温、温循及机械应力下具有稳定的阻值漂移特性。建议在关键应用前参考厂家可靠性报告并进行样机验证。

七、选型与订购

型号:0201WMF3652TEE;品牌:UNI-ROYAL(厚声);封装:0201。下单时请确认包装卷盘(或托盘)数量、工作温度需求及可靠性认证要求,以便匹配具体应用。如需更严格温漂或更高功率,请联系厂家提供替代产品建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.