WMSIC Electronic Components

UNI-ROYAL 201007J0000T4E

Model201007J0000T4E
Package2010
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 201007J0000T4E
Type
UNI-ROYAL
Minimum package
4000 圆盘

Technical parameters

Power
750mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
201007J0000T4E
Electronic Component
1
Package
2010
Electronic Component
SMD Resistor
Electronic Component
±5%
Electronic Component
0.046g
Electronic Component
0Ω
Electronic Component
1
Electronic Component
BM0257341387
Operating Temperature
55℃~+155℃
Operating Voltage
200V
Resistor Type
Resistor
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

201007J0000T4E 产品概述

一、产品简介

201007J0000T4E 是 UNI-ROYAL(厚声)系列的一款贴片厚膜零欧姆电阻,封装为 2010,标称阻值 0Ω,精度 ±5%。它以厚膜工艺制成,作为电路板上的可焊跳线或配置用元件,兼具尺寸小、可靠性高、便于自动化贴装与回流焊接的特点,适用于多种电子产品的信号互连与电路调试场景。

二、主要性能

  • 阻值:0Ω(零欧姆跳线)
  • 精度:±5%
  • 允许功率:750 mW(基于适当散热条件与板上热阻)
  • 工作电压:200 V(最大额定工作电压)
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:2010(贴片形式,便于 SMT 工艺)

三、结构与封装特点

该品采用厚膜沉积与常规电极化处理,外形为标准 2010 贴片封装,适配主流贴片机与回流焊工艺。厚膜结构在机电强度和焊接耐受性上有良好表现,适合批量生产与高温回流循环的组装流程。

四、典型应用

  • PCB 板上跳线或默认连接(信号/电源路线重定向)
  • 系统配置与出厂设置(按需装配或替换)
  • 测试点短接、调试与故障定位
  • 代替桥接线或可更换连接器的低成本方案

五、安装与使用注意事项

  • 建议使用常规 SMT 回流焊工艺;在回流温度曲线和时长上参考焊膏与基板的推荐参数以免影响器件性能。
  • 虽为 0Ω 器件,但仍存在微小接触电阻;在对精确低阻值要求高的应用中应评估是否适用。
  • 最大功率 750 mW 与散热条件有关,安装在铜箔更大或有散热路径的焊盘上有利于提高功率承受能力。
  • 额定工作电压 200 V,应避免在高于额定电压的环境中长期使用以保证安全与可靠性。

六、可靠性与环境适应性

工作温度范围覆盖 -55 ℃ 至 +155 ℃,可在较宽的温度条件下稳定工作。厚膜工艺在机械振动与温度循环中具有良好稳定性,适合工业级应用。出厂与单片测试合格后方可投片使用,必要时可结合环境加速试验验证可靠性。

七、订购信息与替代建议

  • 正式型号:201007J0000T4E(UNI-ROYAL / 厚声)
  • 封装:2010,常见卷带包装,适合自动贴装
  • 选型提示:如需更低阻抗或更高电流承载能力,可考虑金属化零欧姆跳线或多并联器件;若需更高温度或更大功率,应选择更大封装或不同工艺的器件。

如需该型号的详细数据手册(温升曲线、焊接曲线、阻值分布等)或批量价格与交期信息,可提供具体采购数量和应用场景以便进一步确认。

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