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UNI-ROYAL 0201WMF470JTEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF470JTEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF470JTEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 47Ω
- Electronic Component
- 50
- Electronic Component
- BM0263574948
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF470JTEE 产品概述
一、产品简介
0201WMF470JTEE 为 UNI-ROYAL（厚声）系列高密度贴片厚膜电阻，阻值 47Ω，精度 ±1%，额定功率 50mW，最大工作电压 25V。温度系数为 ±200ppm/℃，工作温度范围 -55℃ 至 +155℃，适用于超小型、高密度布板场景。封装规格为 0201（约 0.60mm × 0.30mm），专为尺寸受限的移动设备及高密度模块设计。
二、主要性能特点
- 精度高：阻值公差 ±1%，适合对阻值稳定性有较高要求的电路设计。
- 体积小：0201 超小封装，节省 PCB 面积，支持高密度贴装与轻薄化设计。
- 温度特性：TCR ±200ppm/℃，在宽温区间内维持较好阻值稳定性。
- 工作环境适应性强：工作温度范围宽，满足工业级和消费类产品严苛环境要求。
- 电气安全：最大工作电压 25V，适用于低压信号与功率受限应用。
三、典型应用场景
- 智能手机、平板、可穿戴设备中的限流、分压与阻抗匹配电路；
- IoT 模块、蓝牙/无线射频前端（对空间有严格要求时的阻阻配置）；
- 高密度 PCB 上的电平终端、串联阻尼和信号匹配；
- 精密分压、基准网络及低功耗电子设备中对体积与精度双重要求的场合。
四、可靠性与使用注意
- 贴装与焊接：适配常规 SMT 回流焊工艺，建议遵循厂方回流曲线与焊接规范，避免过长高温暴露。
- 功率热管理：额定功率 50mW 为在基准条件下的最大值，随环境温度上升需进行功率降额设计以保证长期可靠性。
- 机械与化学应力：搬运、回流及清洗过程中避免强烈机械冲击与腐蚀性化学品接触，以防外观与电气性能退化。
- 存储与包装：建议干燥、常温避光保存，使用原厂卷带包装便于 SMT 自动化贴装并降低受潮风险。
五、订购与包装信息
产品型号：0201WMF470JTEE；品牌：UNI-ROYAL（厚声）；封装：0201；阻值/精度：47Ω ±1%；功率/电压：50mW / 25V。通常以卷带（Tape & Reel）方式供应，适配自动贴片生产线。批量采购或需要详细电气、热性能曲线和回流规范，请联系供应商获取完整数据手册与可靠性测试报告。
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