WMSIC Electronic Components

UNI-ROYAL 0402WGF300KTCE

Model0402WGF300KTCE
Package0402
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0402WGF300KTCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Power
62.5mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0402WGF300KTCE
Electronic Component
1
Package
0402
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.009g
Electronic Component
3Ω
Electronic Component
10
Electronic Component
BM0265088811
Operating Temperature
55℃~+155℃
Operating Voltage
50V
Electronic Component
±400ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402WGF300KTCE 厚膜贴片电阻产品概述

一、产品基本属性

0402WGF300KTCE是UNI-ROYAL(厚声)品牌推出的厚膜贴片电阻,采用0402小型化封装,属于低功率、高精度的基础电子元器件,核心定位为满足小型化设备的信号调理、电源滤波等电路需求,兼具成本优势与性能稳定性。

二、核心参数详解

该电阻的关键参数直接决定其适用场景,具体解析如下:

  1. 阻值与精度:标称阻值3Ω,精度±1%(即实际阻值偏差≤±0.03Ω),可满足多数对阻值误差要求不苛刻但需稳定的电路设计;
  2. 功率规格:额定功率62.5mW,为电阻在额定环境温度(通常25℃)下长期稳定工作的最大功率,实际使用建议降额至80%以内(≤50mW),避免过热老化;
  3. 工作电压:最大工作电压50V,需结合阻值计算实际功率(公式:(P=U^2/R)),若电压超过50V需串联分压电阻;
  4. 温度特性:温度系数±400ppm/℃,表示温度每变化1℃,阻值变化量为标称值的百万分之400(如3Ω电阻每度变化±1.2mΩ),适配一般温度波动场景;
  5. 工作温度范围:-55℃~+155℃,覆盖工业级、消费电子及部分汽车电子的典型环境,低温下无阻值突变,高温下无明显失效。

三、典型应用场景

0402WGF300KTCE的小体积、低功耗特性使其在以下领域广泛应用:

  1. 便携电子设备:智能手机、蓝牙耳机、智能手表的信号调理电路、电源滤波电路,适配设备小型化设计;
  2. 可穿戴设备:智能手环、健康监测设备的传感器前端电路,低功耗契合设备续航要求;
  3. 工业传感器模块:温度、压力传感器的信号放大电路,宽温度范围满足工业现场高低温环境;
  4. 小型家电控制板:智能插座、小型加湿器的控制电路,精度满足简单信号调节需求;
  5. 汽车电子(低功耗部分):车载USB充电接口、车内辅助传感器电路,部分汽车级温度要求可覆盖。

四、品牌与工艺优势

UNI-ROYAL(厚声)作为国内电阻制造龙头企业,该产品具备以下优势:

  1. 厚膜工艺优势:采用丝网印刷、高温烧结工艺,稳定性优于薄膜电阻(部分场景),抗机械冲击能力强;
  2. 一致性可靠:批量生产时阻值偏差、温度特性一致性高,减少电路调试难度;
  3. 环保合规:符合RoHS、REACH指令,无铅无卤,适配全球市场环保要求;
  4. 可靠性测试:经过高温老化、温度循环、湿度测试等多重验证,长期使用故障率低。

五、使用与选型注意事项

为确保性能稳定,使用时需注意以下要点:

  1. 功率降额:实际工作功率不超过50mW,避免过热导致阻值漂移;
  2. 电压限制:电阻两端电压≤50V,超压需串联分压;
  3. 焊接要求:0402封装需遵循回流焊曲线(峰值温度230℃~245℃,时间≤10秒),避免手工焊接过热;
  4. 存储条件:常温(15℃35℃)、干燥(湿度30%70%)环境存储,避免受潮影响焊接;
  5. 温度适配:电路温度控制在-55℃~+155℃内,超出范围可能导致阻值异常。

该产品凭借小体积、稳定性能及成本优势,成为小型电子设备的主流选型之一,适用于对体积与性能平衡有要求的各类电路设计。

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