WMSIC Electronic Components

UNI-ROYAL 0201WMF1473TEE

Model0201WMF1473TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF1473TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF1473TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
147kΩ
Electronic Component
10
Electronic Component
BM0265088739
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF1473TEE 产品概述

一、产品简介

0201WMF1473TEE 是 UNI-ROYAL(厚声)出品的一款厚膜贴片电阻,阻值 147kΩ,公差 ±1%,额定功率 50mW,最大工作电压 25V,温度系数(TCR)±200ppm/℃,工作温度范围 -55℃~+155℃,封装为超小型 0201。该型号适用于对体积、封装密度有严格要求的电子产品,兼顾精度与可靠性。

二、主要特性

  • 超小型封装(0201),便于高密度贴装与轻薄化设计。
  • 厚膜工艺,成本与可靠性平衡,适合大批量应用。
  • ±1% 精度,在中等精度电路(分压、偏置、滤波网络等)中表现良好。
  • 额定功率 50mW,适用于小信号及弱功率场合;最大工作电压 25V。
  • TCR ±200ppm/℃,在温度变化时阻值稳定性属于中等水平,能满足多数消费类与工业类应用。

三、典型应用场景

  • 手机、平板、笔记本等消费电子的高密度 PCB。
  • 可穿戴设备与物联网终端的限流、分压与偏置电路。
  • 精度要求非极端苛刻的传感器前端与信号调理电路。
  • 工业与医疗类设备中对体积与组装密度有要求的点位。

四、电气与环境规范(使用建议)

  • 最大额定功率 50mW,应在额定环境温度条件下使用;推荐工作功率做适当降额,避免长时间满载。
  • 最大工作电压 25V,实际设计中请考虑浪涌与脉冲幅值限制。
  • 温度系数 ±200ppm/℃,若电路对温漂敏感,建议采用温漂更低的薄膜或金属膜电阻。
  • 工作温度 -55℃~+155℃,适合宽温度范围的场景;高温下应注意长期失效风险。

五、封装与焊接建议

  • 采用标准贴片回流焊工艺,遵循推荐回流温度曲线以保证焊接可靠性并避免过热导致电阻参数漂移。
  • 在 PCB 布局时留出足够的焊盘与热容量匹配,避免局部过热或机械应力集中。
  • 生产与维修时注意防静电措施和避免机械抓取造成封装破损。

六、选型与注意事项

  • 此型号适合空间受限且对阻值精度有一定要求的应用,但受限于功率与电压,不能替代高功率或高压场合的电阻。
  • 若需更低温漂或更高稳定性,请考虑金属薄膜或更高精度器件。
  • 采购时确认包装形式(卷带/盘装)、批次和原厂认证以保证一致性与可靠性。

总结:0201WMF1473TEE 以其超小封装与 ±1% 精度,在消费电子与高密度应用中具有良好的性价比与使用价值。合理的热和电应力管理能显著提升器件的长期可靠性。

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