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UNI-ROYAL 0201WMF7871TEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF7871TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF7871TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 7.87kΩ
- Electronic Component
- 50
- Electronic Component
- BM0265114461
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF7871TEE 产品概述
一、产品简介
0201WMF7871TEE 是 UNI-ROYAL（厚声）出品的一款超小型贴片厚膜电阻，标称阻值 7.87 kΩ，精度 ±1%，额定功率 50 mW，封装为 0201（微型 SMD）。该器件以小体积、高密度组装兼容性为特点，适合微型化、轻薄化电子设备中的电阻网络与精密阻值分割场景。
二、主要电气与环境参数
- 阻值：7.87 kΩ（标称）
- 精度：±1%
- 额定功率：50 mW
- 最大工作电压：25 V
- 温度系数（TCR）：±200 ppm/℃（典型）
- 工作温度范围：-55 ℃ ~ +155 ℃
- 结构：厚膜电阻，0201 封装
三、产品特点与优势
- 极小封装（0201）可实现高密度装板，节省 PCB 面积，适合移动设备、穿戴与物联网模组。
- ±1% 精度满足精密分压、参考与滤波网络对阻值容差的要求。
- 宽温度范围与相对稳定的 TCR 使得在工业级温度条件下依然保持较好性能。
- 额定电压 25 V 与 50 mW 功率适配低电压电子系统中的常规信号与偏置电路。
四、应用场景
适用于手机与可穿戴设备、无线模组、传感前端、精密分压器、滤波与阻抗匹配电路以及任何对体积和精度有较高要求的电子产品。
五、封装、贴片与可靠性建议
- 推荐按制造商提供的 PCB 焊盘与贴装图规范设计，确保阻容贴装间距与回流焊热冲击匹配。
- 建议采用标准无铅回流焊工艺（依据 JEDEC 型回流曲线），峰值温度建议不超过 260 ℃，并尽量缩短高温停留时间以减少热应力。
- 在高温或高功率工况下应做功率降额设计，遵循器件热耗散特性，避免长时间接近额定功率运行。
- 存储与搬运需防潮、防静电，避免在组装过程中的机械挤压或偏移。
六、设计注意事项
- 不宜将单颗 0201 电阻用于需要大电流或高功率耗散的场合，必要时采用并联或选用功率更高的封装。
- 在高精度应用中，应考虑环境温度变化对阻值的影响，并根据 ±200 ppm/℃ 的 TCR 做温漂补偿或配套校准。
- 回流焊后建议进行在线阻值检测以保证贴装品质。
0201WMF7871TEE 凭借微小体积与稳定电气特性，是追求尺寸最优化与电路精度并重设计的理想选择。如需批量采购或索取封装/回流曲线等详细资料，建议联系 UNI-ROYAL 厂家或授权分销获取官方数据手册。
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