Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0201WMJ0182TEE
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMJ0182TEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMJ0182TEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 1.8kΩ
- Electronic Component
- 50
- Electronic Component
- BM0257644981
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMJ0182TEE 产品概述
一、产品简介
0201WMJ0182TEE 是 UNI-ROYAL（厚声）系列厚膜贴片电阻，阻值 1.8 kΩ，精度 ±5%，额定功率 50 mW，封装尺寸 0201（非常小型）。该元件适用于要求高密度贴装、体积受限的消费电子与便携设备电路中，用于限流、分压、阻尼与偏置等基本功能。
二、主要参数
- 电阻类型：厚膜电阻
- 标称阻值：1.8 kΩ
- 精度：±5%（J）
- 额定功率：50 mW（室温条件）
- 最大工作电压：25 V（器件绝对极限）
- 温度系数（TCR）：±200 ppm/℃
- 工作温度范围：-55℃ 至 +155℃
- 封装：0201（毫米级封装）
- 型号：0201WMJ0182TEE
三、性能特点
- 小型化：0201 尺寸适合高密度布局，节省 PCB 面积。
- 通用性强：厚膜工艺成本低、适应性好，适合大批量制造。
- 宽温度范围：-55℃~+155℃，可在严苛环境下工作。
- 稳定性与容差：±5% 适用于一般精度需求电路；TCR ±200 ppm/℃ 表示温度变化时阻值波动中等，可接受大多数消费类与工业级应用。
四、应用场景
- 手机、可穿戴设备、蓝牙耳机等便携终端的空间受限处的偏置/限流。
- IoT 节点与传感器前端的基础阻性元件。
- 大规模消费电子产品、电视、机顶盒等对成本和封装密度有要求的电路。
- 用作分压器、电平设定与信号阻尼等通用用途。
五、使用与焊接建议
- 功率与电压限制：尽管最大工作电压标称 25 V，但连续工作应以功率为约束。按 P=V^2/R，1.8 kΩ、50 mW 条件下连续允许的跨压约为 9.49 V，超过此电压将导致过热与可靠性下降。
- 回流焊：建议采用标准的无铅回流工艺（遵循 JEDEC 推荐曲线），避免超温及长时间高温暴露以保护电阻性能。
- 贴装/拾取：0201 极小，推荐使用微型吸嘴及高精度贴片机，避免机械应力与错位。
- 焊盘与焊膏：采用适合 0201 的细小焊盘与薄型焊膏印刷工艺，控制焊膏量以防桥连与浮贴。
- 储存与湿敏：按厂家包装与湿敏等级（若有）保存，必要时进行烘干处理以避免回流时裂纹或翘曲。
六、选型与注意事项
- 若电路要求更高精度或更低 TCR，可考虑薄膜或金属膜电阻替代。
- 对于高功率或高电压应用，应选择更大封装或更高功率额定的电阻件。
- 在关键计量或高稳定性电路中，±5% 容差和 ±200 ppm/℃ 的 TCR 可能不足，建议进行电路级补偿或改用高精度器件。
总结：0201WMJ0182TEE 以其超小封装与经济的厚膜工艺，适合大批量、体积受限的常规电子应用，但在使用时需重视功率与温度限制，合理布局与工艺控制可确保长期可靠性。若需详细的回流曲线、封装图或可靠性试验数据，请向供应商索取完整规格书。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
