WMSIC Electronic Components

UNI-ROYAL 4D02WGF1002TCE

Model4D02WGF1002TCE
Package0402x4
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 4D02WGF1002TCE
Type
UNI-ROYAL
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
4D02WGF1002TCE
Electronic Component
1
Package
0402x4
Electronic Component
Resistor Array
Electronic Component
±1%
Electronic Component
0.012g
Electronic Component
10kΩ
Electronic Component
8
Electronic Component
1
Electronic Component
BM0257244997
Electronic Component
±200ppm/℃
Resistor
4
Power
62.5mW
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

4D02WGF1002TCE 产品概述

一、产品简介

4D02WGF1002TCE 是 UNI-ROYAL(厚声)推出的一款四位排阻网络,内部由四个 0402 规格阻值单元集成于一颗 8 引脚封装中。每个单元阻值为 10 kΩ,公差 ±1%,单元额定功率为 62.5 mW(相当于 1/16 W),温度系数典型值为 ±200 ppm/℃。该器件在体积极小的同时提供了阻值一致性和装配便利性,适合空间受限、通用电子设计的阻值网络需求。

二、主要参数

  • 品牌:UNI-ROYAL(厚声)
  • 型号:4D02WGF1002TCE
  • 阻值:10 kΩ(每单元)
  • 精度:±1%(每单元)
  • 单个元件额定功率:62.5 mW(1/16 W)
  • 温度系数(TCR):±200 ppm/℃
  • 元件数:4(排阻)
  • 引脚数:8
  • 封装:0402x4(4×0402 单元集成,8 引脚)
  • 描述:排阻 10 kΩ 62.5 mW ±1%

三、性能特点

  • 紧凑一体化:把四个 0402 等级的电阻单元集成到一个 8 引脚封装中,节省 PCB 面积并减少贴片次数。
  • 一致性好:同一封装内的四个阻值来源相同制程,批内匹配性优于离散贴装,有利于电阻网络匹配要求的应用。
  • 通用电气规格:10 kΩ、±1% 的组合满足多数模拟信号处理、拉/下拉及分压网络的通用需求。
  • 可靠性考虑:采用薄膜/厚膜工艺(视具体系列而定),在常规电子设备环境下表现稳定。
  • 低功耗应用优先:单元功率 62.5 mW,适合便携与低功耗电路,不适合大功率散热场景。

四、典型应用

  • MCU 输入/输出的上拉/下拉网络,减少器件数与贴装时间。
  • 模拟前端分压、参考分配和信号调理场合,需要多路阻值匹配时优先选用。
  • 阻抗匹配与偏置网络,例如传感器接口、ADC 输入通道前的网络。
  • 多路开关或多点检测的阻值统一需求,便于工程调试与替换。
  • 空间受限的消费电子、移动设备、可穿戴设备以及工业控制板卡。

五、设计与选型建议

  • 功率裕度:单个元件额定功率仅 62.5 mW,建议在连续工作条件下留有裕量。对于长期可靠性,实践中常将持续功耗控制在额定值的 50% 以下;如需较高功率,应考虑更大封装或散热设计。
  • 温度敏感性:TCR ±200 ppm/℃ 属于通用级别,若应用对温漂有严格要求(例如精密电桥、精密电流检测),建议选用低 TCR(例如 ±25~±50 ppm/℃)的精密排阻或进行温度补偿。
  • 匹配性:若需严格的通道匹配,应确认器件在相同温度下的阻值漂移一致性及长期阻值漂移(由厂方规格表或样片测试获取)。
  • 电压降与额定功率:在高阻值下通常电流较小,但在设计分压或电流检测时仍需计算每单元实际耗散功率,避免超额定值。

六、封装与焊接建议

  • 封装形式为 0402x4,一般采用卷带(Tape & Reel)供料,适合自动贴装与回流焊工艺。
  • 推荐使用标准无铅回流曲线进行焊接,遵循 PCB 制造与组装流程的温度/时间限制以保证焊点质量与器件性能。
  • 焊接后避免过度机械应力(如强烈挠曲、刮擦),装配时留意施加到封装上的力,防止引脚或电阻膜层受损。

七、可靠性与存储

  • 器件适合典型商业和工业环境,长期可靠性受温度、湿度及功率耗散影响。建议按照供应商提供的储存条件保存,避免高温高湿环境和强腐蚀性气氛。
  • 在进行高加速寿命测试或关键应用时,建议参考并执行供应商的可靠性试验报告(如有),包括温度循环、湿热、焊接热应力等。

八、总结

4D02WGF1002TCE 是一款面向体积受限且需要多路阻值一致性的通用排阻解决方案,具有 10 kΩ、±1% 的电气特性和 1/16 W 的单元功率,适用于便携设备、传感器接口及常规模拟信号网络。在电源与温度敏感的场合,应注意功率裕度和 TCR 要求,必要时选用更高规格的器件或采取补偿措施。购买与设计前建议参考厂方完整规格书以确认所有极限值与封装尺寸。

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