WMSIC Electronic Components

UNI-ROYAL NQ01WMF2202TEE

ModelNQ01WMF2202TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL NQ01WMF2202TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
NQ01WMF2202TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
22kΩ
Electronic Component
1
Electronic Component
BM0263477934
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

NQ01WMF2202TEE 产品概述

一、产品简介

NQ01WMF2202TEE 是 UNI-ROYAL(厚声)推出的一款高密度贴片厚膜电阻,封装为 0201,阻值 22kΩ,公差 ±1%,额定功率 50mW。该器件依靠成熟的厚膜工艺实现小体积下的稳定电阻特性,适用于对体积和可靠性要求较高的移动与消费类电子产品。封装微小、性能均衡,是在超小型化设计中常用的通用型电阻元件。

二、主要性能参数

  • 阻值:22 kΩ(标称)
  • 精度:±1%
  • 额定功率:50 mW(常温)
  • 工作电压:标称 25 V(请以出货数据表为准)
  • 温度系数(TCR):±200 ppm/℃
  • 工作温度范围:-55 ℃ 至 +155 ℃
  • 封装:0201(超小型贴片)
  • 典型可靠性:厚膜工艺常规良好,适应回流焊工艺与常见环境应力

注:基于额定功率与阻值可计算出的理论最大持续电压为 Vmax ≈ √(P·R) ≈ √(0.05×22000) ≈ 33.2 V。若产品文档或订货信息标注为 50 V,应以厂家技术说明为准并注意功率和电压的配合及降额使用。

三、典型应用场景

  • 移动终端与可穿戴设备:在要求极限空间约束下用于分压、偏置与限流电路。
  • 传感器与测量模块:与高阻输入配合实现偏置与参考网络。
  • 模拟前端与滤波网络:在体积最小化的滤波/阻容网络中作为阻值元件使用。
  • 低功耗电路与便携设备:用于电压检测、上拉/下拉网络等低电流场合。

四、可靠性与工艺建议

  • 焊接工艺:0201 封装兼容常规无铅回流焊工艺(建议遵循厂家回流曲线与峰值温度限制)。
  • 热功耗与降额:在长时间工作或高环境温度下需按降额曲线考虑额定功率的衰减,避免接近或超过额定功耗。
  • 机械应力:超小型封装对 PCB 弯曲与机械应力敏感,装配与焊接时应控制板面挠度和夹具压迫。
  • 环境与清洗:厚膜电阻耐普通清洗工艺,但建议使用与厂家兼容的溶剂与工艺,避免化学污染导致电阻漂移。
  • 噪声与稳定性:厚膜元件相较于金属膜电阻噪声略高,温漂 TCR ±200 ppm/℃,在高精度度量场合需预留温度补偿或选用更低 TCR 器件。

五、选型与使用建议

  • 余量设计:实际电路中建议留有电压与功率裕量,尽量使器件实际消耗功率低于额定功率的 60–70% 以提升可靠性。
  • 验证出货数据:市场描述偶有电压/功率标注差异,最终选型前请索取并核对 UNI-ROYAL 的正式规格书与样品测试报告。
  • PCB 布局:遵循厂家推荐焊盘与回流曲线,减小焊接应力并保证热量均匀散布;对于高阻值网络,注意避免近邻高湿或有导电残留的区域。
  • 备件与替代:若对噪声、温漂或长期稳定性有更高要求,可考虑金属膜或厚膜的特殊等级替代品。

以上为 NQ01WMF2202TEE 的概要说明。若需完整电气特性表、封装尺寸图、回流焊建议曲线或样品验证数据,请联系 UNI-ROYAL 或向供应商索取最新数据手册。

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