WMSIC Electronic Components

UNI-ROYAL 0201WMF4532TEE

Model0201WMF4532TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF4532TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF4532TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
45.3kΩ
Electronic Component
50
Electronic Component
BM0257242459
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF4532TEE 产品概述 — UNI-ROYAL(厚声)

一、产品简介

0201WMF4532TEE 是 UNI-ROYAL(厚声)系列的贴片厚膜电阻,阻值 45.3 kΩ,精度 ±1%,额定功率 50 mW,工作电压 25 V。该器件采用超小型 0201 封装(典型尺寸约 0.6 mm × 0.3 mm),适用于对体积和重量要求极高的现代电子产品,如移动设备、可穿戴设备、微型传感器和高密度混合信号模块。

二、主要电气参数

  • 阻值:45.3 kΩ(标称)
  • 精度:±1%(典型等级)
  • 额定功率:50 mW(环境温度下)
  • 最高工作电压:25 V(最大允许电压)
  • 温度系数:±200 ppm/°C
  • 工作温度范围:-55 ℃ 至 +155 ℃

三、产品特点

  • 超小体积:0201 封装节省 PCB 面积,便于高密度布局。
  • 稳定性好:厚膜工艺在常见温湿度和机械应力下表现出良好的长期稳定性。
  • 宽温区工作:适应汽车电子、工业级温度环境需求(-55 ℃ 至 +155 ℃)。
  • 高可靠性:适配回流焊装配流程,满足批量生产装配要求。

四、典型应用场景

  • 智能手机、平板和可穿戴终端中的分压、电流检测与偏置网络。
  • 物联网节点、微型传感器和无线模块的阻抗匹配与滤波电路。
  • 医疗便携设备、手持测试仪器及其他对体积敏感的电子产品。
  • 工业控制小型化电路板、精密测量及信号处理模块。

五、装配与工艺建议

  • 贴装:0201 需使用高精度贴装设备,注意吸嘴尺寸与定位精度。
  • 焊接:适配无铅回流焊工艺,推荐严格控制锡膏用量与回流曲线以避免焊盘开裂或偏位。
  • 焊膏印刷:锡膏量不宜过多,避免焊球或桥连;使用微型模板孔和精细间距工艺。
  • 清洗与后处理:遵循 PCB 和工艺规范,避免强酸强碱清洗剂直接作用于电阻表面。

六、可靠性与降额建议

  • 功率降额:小型封装在高环境温度下需进行功率降额设计,建议参考厂商功率-温度特性曲线并留有安全裕量。
  • 熔断与过压保护:在高阻值和低功率条件下仍应关注瞬态过压和浪涌电流,必要时并联限流或保护元件。
  • 机械应力:避免在贴装后对电阻施加过大的机械弯折或冲击,以减少失效风险。

七、包装、选型与质量保证

  • 封装形式:0201 卷带式包装,适合自动贴片生产线。
  • 型号提示:0201WMF4532TEE 对应 45.3kΩ ±1% 厚膜电阻,选型时请确认工作电压与功耗余量。
  • 质保与检测:建议在设计阶段与供应商确认批次属性、老化数据及出厂检验报告,以保证长期可靠性。

如需更详细的电气特性曲线、回流焊温度曲线或样品测试报告,可向供应渠道索取器件详细规格书与可靠性验证数据。

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