WMSIC Electronic Components

UNI-ROYAL 0201WMF8062TEE

Model0201WMF8062TEE
Package0201
BrandUNI-ROYAL
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
UNI-ROYAL 0201WMF8062TEE
Type
UNI-ROYAL
Minimum package
15000 圆盘

Technical parameters

Power
50mW
Electronic Component
Electronic Component
Electronic Component
UNI-ROYAL
Electronic Component
0201WMF8062TEE
Electronic Component
1
Package
0201
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.008g
Electronic Component
80.6kΩ
Electronic Component
10
Electronic Component
BM0265061215
Operating Temperature
55℃~+155℃
Operating Voltage
25V
Electronic Component
±200ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0201WMF8062TEE 产品概述

一、产品简介

0201WMF8062TEE 是 UNI-ROYAL(厚声)推出的一款高密度贴片厚膜电阻,阻值为 80.6kΩ,精度 ±1%,额定功率 50mW,适用于对体积、精度和装配密度有较高要求的现代电子产品。该器件采用 0201 小封装,适配主流自动贴装与回流焊工艺,适合批量生产与高密度布板应用。

二、主要技术参数

  • 电阻类型:厚膜电阻
  • 阻值:80.6 kΩ(标称)
  • 精度:±1%
  • 功率:50 mW(额定)
  • 工作电压:25 V(最大)
  • 温度系数(TCR):±200 ppm/°C
  • 工作温度范围:-55 ℃ ~ +155 ℃
  • 封装:0201(英制典型尺寸约 0.6 mm × 0.3 mm)
  • 品牌:UNI-ROYAL(厚声)

三、电性能与温度影响

TCR 为 ±200 ppm/°C,相当于温度每变化 1 ℃ 时阻值约变化 0.02%。例如环境温度变化 50 ℃ 时,阻值变化约 1% 左右(叠加初始公差)。额定功率 50 mW 在高温时需按厂商的功率降额曲线处理;超出 25 V 或额定功率范围会缩短寿命或损坏器件。

四、封装与装配建议

0201 小体积带来空间优势,也对贴装与回流提出要求:

  • 推荐使用匹配的贴片吸嘴与高速贴装设备;避免机械挤压导致端电极损伤。
  • 建议采用对称焊盘、均匀焊膏量以降低 tombstoning(立碑效应)概率。
  • 可兼容常规无铅回流,但请遵循制造商建议的回流曲线,避免过高峰值温度与长时间加热。
  • 小封装对焊接、测试、维修提出挑战,设计时应考虑测试点与可检修性。

五、典型应用场景

  • 手机、平板、可穿戴设备等高密度消费电子的分压、偏置与反馈网络。
  • IoT 终端、蓝牙模块等对体积要求严格的电路。
  • 一般信号处理与偏置电路,非超高精度的电阻网络。
    注:由于 TCR 为 ±200 ppm/°C,需在温度稳定或允许一定漂移的场合使用。

六、选型与并联/串联建议

  • 若需更高耐压,可通过串联多个电阻分担电压;若需提升功率承受能力,可并联多个相同阻值器件。
  • 对于温漂或长期稳定性要求更高的场合,应考虑薄膜或精密电阻替代,或选择更低 TCR 的产品。

七、可靠性与储存

  • 存放环境应避免潮湿、强腐蚀性气体与剧烈振动;长期储存前可参照厂商防潮包装与建议。
  • 装配时避免长时间机械应力与重复弯曲,检验焊接质量以保障可靠性。

八、结语

0201WMF8062TEE 以其小体积、±1% 的精度和 50mW 的额定功率,适合高密度 PCB 与常规精度要求的电子系统。设计与装配时需注意温漂影响、功率降额与小封装的贴装工艺,以确保长期稳定性与可靠性。如有更严格的温度系数、功率或耐压需求,建议联系供应商获取更详细的规格书与应用建议。

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