Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
UNI-ROYAL 0201WMF200JTEE
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- UNI-ROYAL 0201WMF200JTEE
- Type
- UNI-ROYAL
- Minimum package
- 15000 圆盘
Technical parameters
- Power
- 50mW
- Electronic Component
- Electronic Component
- Electronic Component
- UNI-ROYAL
- Electronic Component
- 0201WMF200JTEE
- Electronic Component
- 1
- Package
- 0201
- Electronic Component
- SMD Resistor
- Electronic Component
- ±1%
- Electronic Component
- 0.008g
- Electronic Component
- 20Ω
- Electronic Component
- 50
- Electronic Component
- BM0263477428
- Operating Temperature
- 55℃~+155℃
- Operating Voltage
- 25V
- Electronic Component
- ±200ppm/℃
- Resistor Type
- Resistor
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0201WMF200JTEE 产品概述
一、产品简介
0201WMF200JTEE 为 UNI-ROYAL（厚声）公司出品的一款厚膜贴片电阻，阻值为 20Ω，精度 ±1%，额定功率 50mW。该型号采用 0201 小尺寸封装，适合超小型、高密度的表面贴装电路。凭借厚膜工艺与严苛的制造流程，此元件在体积极小的同时保持稳定的电性能，适用于移动终端、可穿戴设备、传感器以及高密度模块等领域。
二、主要技术参数
- 电阻类型：厚膜电阻
- 标称阻值：20Ω
- 精度：±1%（J）
- 额定功率：50mW
- 最高工作电压：25V
- 温度系数（TCR）：±200 ppm/℃
- 工作温度范围：-55℃ ~ +155℃
- 封装：0201（超小型贴片）
三、性能特点
- 小尺寸高密度：0201 封装可显著节省 PCB 面积，适合微型化设计。
- 精度与稳定性：±1% 精度配合 ±200 ppm/℃ 的温度系数，在多数模拟与数模混合电路中能提供可靠阻值参考。
- 低功耗特性：50mW 的额定功率适用于信号级、偏置和分流等低功耗场合。
- 宽温度适应：-55℃ 至 +155℃ 的工作温度范围满足工业级环境需求。
四、典型应用场景
- 移动设备与可穿戴电子：用于电流检测、分压、限流等场合；
- 精密小型传感器与前端电路：在受限空间内实现精确阻值匹配；
- 高密度模块与射频前端（信号链低功耗部分）；
- 测试与测量仪器（低功耗分流、阻值网络）。
五、封装与焊接建议
- 贴装：0201 尺寸极小，建议使用高精度点胶/贴装设备与细间距吸笔；
- 回流焊：采用符合 IPC/JEDEC 推荐的无铅或有铅回流温度曲线；避免超出元件最大热负荷时间。
- 焊膏与焊盘：推荐使用细型焊膏与优化焊盘设计以防桥连或虚焊；注意锡膏量与印刷一致性。
- 取样测试：20Ω 属较低阻值范围，批量检验时建议采用四线（Kelvin）测量以消除引线及接触电阻影响。
六、可靠性与使用注意
- 功率降额：在高温或散热受限场合，需按厂方推荐进行功率降额设计，避免长期超额功耗导致漂移或失效；
- 最大工作电压：25V 为推荐工作电压上限，超压可能引起绝缘击穿或寿命下降；
- 潮湿与清洗：封装尺寸较小，清洗时注意避免长时间浸泡与强力超声，以免机械损伤或焊点问题；
- 存储与搬运：防潮包装保存，贴装前按回流焊工艺要求回温回潮；搬运避免机械弯折或强振动。
七、选型与应用建议
- 若电路对温漂与长期稳定性有更高要求，可考虑更低 TCR 或金属膜/薄膜工艺产品；
- 在电流感应类应用，若需更高功率或更小的功率损耗，应选择更大功率等级或分流器设计；
- 批量采购时建议索取 UNI-ROYAL 的完整数据手册与可靠性报告（如老化、湿热、焊接冲击测试），以便在特定工况下做充分验证。
本概述基于 0201WMF200JTEE 的基础参数与典型应用经验，为设计与选型提供参考。实际应用中请结合厂方数据手册与实际检测结果进行最终确认。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
